JB/T 10845-2008General process specification for lead-free reflow soldering (English PDF)
无铅再流焊接通用工艺规范
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Issued by
MIIT
Level / Type
Industry · Recommended
Issue date
February 1, 2008
Implementation date
July 1, 2008
Scope
JB/T 10845-2008 is the English-translated version of 无铅再流焊接通用工艺规范.
JB/T 10845-2008 is the recommended Chinese machinery industry standard that lays down the general process specification for lead-free reflow soldering. It states the basic process requirements to be followed when electronic assembly products are soldered by lead-free reflow, and the rules for inspecting the quality of the work. Its field of application is the processing and the quality inspection of electronic assemblies built on printed circuit board substrates and soldered lead-free by forced hot air or by infrared reflow. It quotes SJ/T 11216-1999 and IPC-A-610D. The classifications recorded for the document are L30 in the Chinese system and 31.180 in the international one.
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Document preview — JB/T 10845-2008
National Standard of the People's Republic of China
- ICS
- 31.180
Issued by: Ministry of Industry and Information Technology of the People's Republic of China
Contents
- 2 Normative references
2 Normative references
JB/T 10845-2008 cites the following standards, which apply in full or in part through the references made to them in its clauses.
SJ/T 11216-1999
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 18 pages — is available in the English PDF.
Referenced standards
Normative references
SJ/T 11216-1999
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