JB/T 6173-2014No-clean lead-free soldering fluxes (English PDF)
免清洗无铅助焊剂
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Issued by
MIIT
Level / Type
Industry · Recommended
Issue date
May 6, 2014
Implementation date
October 1, 2014
Scope
JB/T 6173-2014 is the English-translated version of 免清洗无铅助焊剂.
JB/T 6173-2014 is the recommended Chinese machinery industry standard for no-clean lead-free soldering fluxes. It gives the terms and definitions for this flux type, the requirements it has to meet, the test methods, the inspection rules and the provisions for packaging, labelling, transport and storage. Its application is the no-clean lead-free flux itself, the consumable used in electronics soldering where no post-solder cleaning step is wanted. The chemical and environmental test work is anchored in GB/T 611-2006, GB/T 2040-2008, GB/T 2423.32-2008, GB/T 9724-2007, SH 0164-1992 and YB/T 724-2005, with sampling from GB/T 2828.1-2012 and GB/T 2829-2002. It replaces JB/T 6173-1992. Issued on 6 May 2014, it has applied since 1 October 2014.
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Document preview — JB/T 6173-2014
National Standard of the People's Republic of China
- ICS
- 31.030
- Replacing
- JB/T 6173-1992
Issued by: Ministry of Industry and Information Technology of the People's Republic of China
Contents
- 2 Normative references
2 Normative references
JB/T 6173-2014 cites the following standards, which apply in full or in part through the references made to them in its clauses.
GB 190-2009
GB/T 191-2008
GB/T 611-2006
GB/T 2040-2008
GB/T 2423.32-2008
GB/T 2828.1-2012
GB/T 2829-2002
GB/T 9724-2007
SH 0164-1992
YB/T 724-2005
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 191-2008Graphical symbols marking for handling and storage of packages
- GB/T 611-2006Chemical reagent - General method for the determination of density
- GB/T 2040-2008Copper and copper alloy sheet
- GB/T 2828.1-2012Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection
- GB/T 2829-2002Sampling procedures and tables for periodic inspection by attributes
GB 190-2009 · GB/T 2423.32-2008 · GB/T 9724-2007 · SH 0164-1992 · YB/T 724-2005
Similar standards
Editions of JB/T 6173
| Edition | Title | Revision | Status |
|---|---|---|---|
| JB/T 6173-2014 | No-clean lead-free soldering fluxes | current edition | Current |
| JB/T 6173-1992 | No-clean lead-free soldering fluxes | previous edition | Superseded |
This page sells the current edition, JB/T 6173-2014. Earlier editions are listed for reference only.
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Related Standards
GB/T 2828.1-2012 — Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection
JB/T 106-2024 — Valves marking and coating
JB/T 14540-2024 — Sanitary cam rotor pumps
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JB/T 6173-2014
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