GB/T 38265.6-2022Test methods for soft soldering fluxes - Part 6: Determination of halide(excluding fluoride) content (English PDF)

foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules for Standardization Documents"

drafting.

This document is part 6 of GB/T 38265 "Test Methods for Solder Flux". GB/T 38265 has released the following parts.

--- Part 1.Gravimetric method for the determination of non-volatile matter content;

--- Part 2.Determination of non-volatile matter content boiling point method;

--- Part 3.Determination of acid value Potentiometric titration and visual titration;

--- Part 5.Copper mirror test;

--- Part 6.Determination of content of halides (excluding fluorides);

--- Part 8.Determination of zinc content;

--- Part 9.Determination of ammonia content;

--- Part 10.Solder wetting performance spreading test method;

--- Part 11.Solubility of flux residues;

--- Part 13.Determination of flux splashing;

--- Part 14.Evaluation of the adhesiveness of flux residues;

--- Part 15.Copper corrosion test;

--- Part 16.Solder wetting performance Wetting balance method;

--- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test.

This document is modified to adopt ISO 9455-6.1995 "Test methods for soldering fluxes - Part 6.Content of halides (excluding fluorides)

Determination".

Compared with ISO 9455-6.1995, this document has more structural adjustments. Comparison overview of structure number changes between two files

See Appendix A for the table.

The technical differences between this document and ISO 9455-6.1995 and their reasons are as follows.

--- Increase the reference to HG/T 2892 (see 4.2.1, 7.2.1) to adapt to my country's technical conditions and increase operability;

--- Increased the requirements of "laboratory analytical balance" in the equipment (see 4.3.1, 6.3.1, B.4.1), to facilitate the application of this document;

--- ISO 9455-1 (see 4.5) is replaced by the normatively quoted GB/T 38265.1, and the degree of consistency between the two documents is revised

To adapt to my country's technical conditions and increase operability;

--- ISO 9455-2 (see 4.5) is replaced by GB/T 38265.2 with normative references, and the degree of consistency between the two documents is revised

To adapt to my country's technical conditions and increase operability;

--- Increase the reference to GB/T 9335 (see 5.2.1, 6.2.3) to adapt to my country's technical conditions and increase operability;

--- Increase the reference to GB/T 626 (see 5.2.2) to adapt to the technical conditions of our country and increase operability;

--- Increase the reference to GB/T 9854 (see 6.2.1) to adapt to the technical conditions of our country and increase operability;

--- Changed the expression of the reagent "oxalic acid" (see 6.2.1) to adapt to the technical conditions of our country;

--- Increase the reference to GB/T 686 (see 7.2.2) to adapt to the technical conditions of our country and increase operability;

--- Increase the reference to GB/T 11415 (see 7.3.2) to adapt to the technical conditions of our country and increase operability;

--- ISO 5725-2 (see 8.1) is replaced by the normatively quoted GB/T 6379.2, and the degree of consistency between the two documents is revised

To adapt to the technical conditions of our country and increase operability;

--- Changed the preparation method of phenolphthalein indicator solution (see B.3.5) to adapt to the technical conditions of our country;

--- Added the characteristic expression of "dryer" (see B.4.3) to facilitate the application of this document.

The following editorial changes have been made to this document.

--- In order to coordinate with existing standards, the name of the standard was changed to "Test methods for soldering fluxes Part 6.Halides (excluding fluorides)

Determination of content";

--- Replaced ISO 9454-1 with the informative referenced GB/T 15829 and moved to the references (see Chapter 1) to adapt to my country's

Technical conditions, in line with the standard writing requirements.

Please note that some contents of this document may refer to patents. The issuing agency of this document assumes no responsibility for identifying patents.

Introduction

As the key supporting combination material in the soldering process, soldering agent has a decisive influence on the quality of soldered joints.

The strong foundation project being implemented, the national science and technology major project "core electronic devices, high-end general-purpose chips and basic software products" and "ultra-large-scale

Technology research and development of core electronic devices, high-end chips and integrated circuit complete sets of technology in the Special Project of Modular Integrated Circuit Manufacturing Equipment and Complete Processes

Among them, solder is the key basic material, and the formulation of test method standards for its quality performance evaluation is of great significance.

Since.2001, my country has promulgated and implemented GB/T 3131 "Sn-Lead Solder", GB/T 20422 "Lead-Free Solder",

GB/T 15829 "Classification and Performance Requirements of Solder Fluxes" and GB/T 28770 "Test Methods for Solder Materials" and other supporting standards, solder

As an important component of solder, solder not only has an important impact on the solderability and manufacturability of solder, but also affects the environment, the reliability of solder joints and

And application is also very important. GB/T 38265 "Test Methods for Soldering Fluxes" is the general test method standard for soldering fluxes. It is proposed to be composed of the following parts

constitute.

--- Part 1.Gravimetric method for the determination of non-volatile matter content. The purpose is to specify the use of gravimetric method to determine the non-volatile

Test method for substance content.

--- Part 2.Determination of non-volatile matter content Boiling point method. The purpose is to stipulate the determination of the non-volatile oil in solder by the boiling point method.

Test method for substance content.

--- Part 3.Determination of acid value potentiometric titration and visual titration. The purpose is to specify the use of potentiometric titration and visual titration

Standard test method for the determination of acid value in solder.

--- Part 5.Copper mirror test. The purpose of this specification is to specify a test method for evaluating the aggressiveness of solder to copper by means of the copper mirror test.

--- Part 6.Determination of halide (excluding fluoride) content. The purpose is to specify the use of three quantitative methods for the determination of solder flux

Ionic Halide Content and a Qualitative Method Test Method for the Presence of Ionic Halides in Solder Fluxes.

--- Part 8.Determination of zinc content. The purpose is to specify the test for the determination of zinc content in soldering flux by EDTA titration method

method.

--- Part 9.Determination of ammonia content. Its purpose is to specify a test method for the determination of the ammonia content of solder fluxes.

--- Part 10.Solder wetting performance spreading test method. The purpose is to specify the use of spreading method to evaluate the wetting performance of solder

test method.

--- Part 11.Solubility of flux residues. The purpose is to specify a qualitative method for the evaluation of solder residues in selected solvents

Solubility test method.

--- Part 13.Determination of flux splashing. Its purpose is to specify a test method for evaluating the spattering properties of solder fluxes on steel test pieces.

--- Part 14.Evaluation of the adhesiveness of flux residues. The purpose is to specify the use of chalk powder for the evaluation of residues after soldering after soldering.

Adhesive test method.

--- Part 15.Copper corrosion test. The purpose is to specify the qualitative evaluation of the surface of copper plates using the copper corrosion test under controlled environmental conditions.

Test method for corrosivity of solder residues.

--- Part 16.Solder wetting properties Wetting balance method. The purpose is to specify the use of wetting balance method to evaluate the wettability of solder

capable test method.

--- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test. The purpose is to specify the use of surface

Insulation resistance comb test and electrochemical migration test to evaluate the corrosion of flux residues on the surface of the test piece after soldering

method.

This document uses three quantitative methods to determine the content of ionic halides in solder and a qualitative method to analyze the presence of ionic halides in solder.

These methods have the advantages of simple operation, strong applicability, accurate and reliable results, etc., and have become an important method in solder products.

means of detection.

Test methods for soldering fluxes - Part 6.Halides

(excluding fluoride) content determination

1 Scope

This document specifies three quantitative determination methods for ionic halide content in solder and a qualitative analysis method for ionic halide.

Including principles, reagents, instruments and equipment, test procedures, test data processing, expression of test results, precision, test reports, etc.

Method A in this document is applicable to Type 1 and Type 2 solder fluxes defined in GB/T 15829, and as non-volatile substances in halogenated

Reference method for soldering flux with content of 0.05%~2% (mass fraction).

Method B in this document is applicable to halides (excluding fluorinated

substance) determination of the total content.

Method C in this document is applicable to water-soluble solder fluxes of type 321 defined in GB/T 15829 and containing phosphates.

Method D in this document is applicable to the qualitative analysis of ionic halides in all types of solders.

2 Normative references

The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references

For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to

this document.

GB/T 626 Chemical Reagent Nitric Acid (GB/T 626-2006, ISO 6353-2.1983, NEQ)

GB/T 686 Chemical Reagent Acetone (GB/T 686-2008, ISO 6353-2.1983, NEQ)

GB/T 6379.2 Accuracy of measurement methods and results (trueness and precision) - Part 2.Determination of repeatability of standard measurement methods

Basic methods of reliability and reproducibility (GB/T 6379.2-2004, ISO 5725-2.1994, IDT)

GB/T 9335 Nitrobenzene

GB/T 9854 Chemical reagent oxalic acid dihydrate (oxalic acid) (GB/T 9854-2008, ISO 6353-2.1983, NEQ)

GB/T 11415 Laboratory sintered (porous) filter pore size, classification and grade (GB/T 11415-1989, NEQISO 4793-

1980)

GB/T 38265.1 Test methods for solder fluxes Part 1.Gravimetric method for the determination of non-volatile matter content (GB/T 38265.1-

2019, ISO 9455-1.1990, MOD)

GB/T 38265.2 Soldering Flux Test Methods Part 2.Determination of Non-volatile Matter Content by Boiling Point Method (GB/T 38265.2-

2019, ISO 9455-2.1993, MOD)

HG/T 2892 Chemical Reagent Isopropanol (HG/T 2892-2020, ISO 6353-3.1987, NEQ)

3 Terms and Definitions

This document does not have terms and definitions that need to be defined.

4 Method A potentiometric titration