GB/T 8446.3-2022Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" drafted.

GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard.

---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices;

---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices;

---JB/T 8757 Heat pipe radiator for power semiconductor devices;

---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices.

This document is part 3 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts.

--- Part 1: Heat sink;

--- Part 2: Measurement methods of thermal resistance and flow resistance;

--- Part 3: Insulation and fasteners.

This document replaces GB/T 8446.3-2004 "Radiators for Power Semiconductor Devices - Part 3: Insulators and Fasteners". and Compared with GB/T 8446.3-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows.

a) Changed the "normative references" (see Chapter 2, Chapter 2 of the.2004 edition);

b) the chapter "Terms and Definitions" was added (see Chapter 3);

c) Changed the dielectric withstand voltage and high temperature performance requirements of insulating parts (see 4.3.2 and 4.3.4, 3.3.2 and 3.3.4 of the.2004 edition), added flame retardant properties and comparative tracking index (CTI) requirements for insulating parts (see 4.3.5 and 4.3.6);

d) Changed the appearance requirements of fasteners (see 5.3.1, 4.3.1 of the.2004 edition);

e) Changed the inspection rules (see Chapter 6, Chapter 5 of the.2004 edition);

f) Changed Appendix A (see Appendix A, Appendix A of the.2004 edition).

Introduction

GB/T 8446 "Heat sinks for power semiconductor devices" gives the heat sinks, insulating parts and fasteners that constitute heat sinks for power semiconductor devices.

Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are planned to consist of 3 part composition.

--- Part 1: Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage.

--- Part 2: Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators).

--- Part 3: Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage.

1 Scope

This document specifies the model and series, dimensions, other technical requirements, inspection inspection rules and packaging and shipping requirements.

This document applies to insulating parts and fasteners of cast (including extruded) heat sinks for power semiconductor devices, and also applies to mounting dimensions Insulators and fasteners for profile radiators and heat pipe radiators that are the same as cast (including extruded) radiators.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document.

GB/T 1031 Product Geometric Specifications (GPS) Surface Structure Profile Method Surface Roughness Parameters and Their Values

GB/T 2423.2-2008 Environmental testing of electrical and electronic products - Part 2: Test method Test B. High temperature

GB/T 2423.17-2008 Environmental Testing of Electrical and Electronic Products Part 2: Test Method Test Ka. Salt Spray

GB/T 2423.22-2012 Environmental Test Part 2: Test Method Test N. Temperature Change

GB/T 4207-2012 Determination method of tracking resistance index and comparative tracking index of solid insulating materials

GB/T 5169.11-2017 Fire hazard test for electrical and electronic products - Part 11: Basic test method for glow wire/hot wire Glow Wire Flammability Test Method for Products (GWEPT)

GB/T 8446.1 Heat sinks for power semiconductor devices - Part 1: Heat sinks

3 Terms and Definitions

Terms and definitions defined in GB/T 8446.1 apply to this document.

4 Insulation