GB/T 8446.1-2022Heat sinks for power semiconductor devices—Part 1: Radiators (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" drafted.

GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard.

---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices;

---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices;

---JB/T 8757 Heat pipe radiator for power semiconductor devices;

---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices.

This document is part 1 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts.

--- Part 1: Heat sink;

--- Part 2: Measurement methods of thermal resistance and flow resistance;

--- Part 3: Insulation and fasteners.

This document replaces GB/T 8446.1-2004 "radiators for power semiconductor devices - Part 1: Casting series". and Compared with GB/T 8446.1-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows.

a) Changed the "scope" and "normative references" (see Chapters 1 and 2, Chapters 1 and 2 of the.2004 edition);

b) Changed the definitions of "heat sink", "heat sink", "thermal resistance", "flow resistance", "tabletop" and "tabletop temperature", and added "(water cooling body)

The definition of "cavity" (see Chapter 3, Chapter 3 of the.2004 edition);

c) Change "water-cooled radiator" to "water-cooled radiator" (see 4.1, 6.2 and Chapter 7, 4.2, 5.4, Chapter 6 and.2004 edition). Chapter 7);

d) Deleted bolt-shaped self-cooling radiator SZ series and bolt-shaped air-cooling radiator SL series (see 4.3, Chapter 5 of the.2004 edition and Chapter 6);

e) change the notation "alpha" representing the angle in Figure 4 and Table 4 to "beta" (see 5.2.1, 5.4 of the.2004 edition);

f) Added SF3× series heat sink and SS3× series heat sink (see Chapter 4~Chapter 6);

g) Changed the provisions on the leakage test pressure of the cavity of the water cooling radiator (see 6.2, 6.3 of the.2004 edition), deleted the withstand voltage of the insulating parts Pressure requirements and regulations on heat sink material (see 6.3.1 and 6.4 of the.2004 edition);

h) Added requirements for salt spray resistance (see 6.1 and 7.2);

i) Changed "periodic inspection" to "type test", and changed the corresponding provisions (see 7.2, 7.2 of the.2004 edition);

j) Changed Appendix A and Appendix B (see Appendix A and Appendix B, Appendix A and Appendix B of the.2004 edition).

Introduction

GB/T 8446 "Heat radiator for power semiconductor devices" gives the radiator, insulating parts and fasteners that constitute the heat sink for power semiconductor devices Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are to be determined by 3 part composition.

--- Part 1: Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage.

--- Part 2: Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators).

--- Part 3: Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage. Heat sinks for power semiconductor devices Part 1: Heat sink

1 Scope

This document specifies the terms and definitions, types and cooling methods, external dimensions and installation dimensions of heat sinks for power semiconductor devices dimensions, technical requirements, inspection rules, and requirements for marking, packaging, transportation and storage.

This document applies to air-cooled heat sinks and water-cooled heat sinks for power semiconductor devices. Dimensions and mounting dimensions conform to this article The profile heat sinks specified in Chapter 5 of the software can also be used by reference.

This document does not apply to heat pipe type heat sinks.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document.

GB/T 1031-2009 Product Geometric Technical Specification (GPS) Surface Structure Profile Method Surface Roughness Parameters and Their Values

GB/T 1804-2000 General Tolerances Unmarked Tolerances of Linear and Angular Dimensions

GB/T 1958-2017 Product Geometric Specifications (GPS) Geometric Tolerance Detection and Verification

GB/T 2423.17-2008 Environmental Testing of Electrical and Electronic Products Part 2: Test Method Test Ka. Salt Spray

GB/T 8446.2 Heat sinks for power semiconductor devices - Part 2: Test methods for thermal resistance and flow resistance

GB/T 8446.3 Heat sinks for power semiconductor devices - Part 3: Insulators and fasteners

JB/T 4159 General technical requirements for tropical electrical products

3 Terms and Definitions

The following terms and definitions apply to this document.