GB/T 8446.2-2022Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" drafted.

GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard.

---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices;

---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices;

---JB/T 8757 Heat pipe radiator for power semiconductor devices;

---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices.

This document is part 2 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts.

--- Part 1: Heat sink;

--- Part 2: Measurement methods of thermal resistance and flow resistance;

--- Part 3: Insulation and fasteners.

This document replaces GB/T 8446.2-2004 "Heat sinks for power semiconductor devices - Part 2: Test methods for thermal resistance and flow resistance".

Compared with GB/T 8446.2-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows.

a) Two chapters "normative references" and "terms and definitions" have been added (see Chapters 2 and 3);

b) The provisions on thermal resistance measurement have been changed and used as Chapter 4 (see Chapter 4, Chapters 2 to 5 of the.2004 edition);

c) Changed the provisions of the flow resistance measurement, and as Chapter 5 (see Chapter 5, 3.2, 3.4 and Chapter 5 of the.2004 edition).

Introduction

GB/T 8446 "Heat radiator for power semiconductor devices" gives the radiator, insulating parts and fasteners that constitute the heat sink for power semiconductor devices Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are to be determined by 3 part composition.

--- Part 1: Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage.

--- Part 2: Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators).

--- Part 3: Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage.

1 Scope

This document gives the terms and definitions and measurement methods of thermal resistance and flow resistance of heat sinks for power semiconductor devices.

This document applies to the measurement of thermal and flow resistance of heat sinks (including cast, extruded, profiled and heat pipe heat sinks) for power semiconductor devices.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document.

GB/T 8446.1-2022 Heat sinks for power semiconductor devices - Part 1: Heat sinks

3 Terms and Definitions

Terms and definitions defined in GB/T 8446.1-2022 apply to this document.