GB/T 42973-2023Semiconductor integrated circuits—Digital-analog (DA) converter (English PDF)
半导体集成电路 数字模拟（DA）转换器
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 7, 2023
Implementation date
January 1, 2024
Scope
GB/T 42973-2023 is the English-translated version of 半导体集成电路 数字模拟（DA）转换器.
GB/T 42973-2023 is the Chinese standard "Semiconductor integrated circuits—Digital-analog (DA) converter". Its scope clause reads: This document specifies the classification, technical requirements, test methods, and Inspection rules, marking, packaging, transportation and storage.
This document applies to DA converters designed and manufactured using semiconductor integrated circuit technology. Its clauses include normative reference documents.
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Document preview — GB/T 42973-2023
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L 56
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 Normative reference documents
- 3 Terms and Definitions
- 4 Category
- 4.1 Overview
- 4.2 Nyquist Rate DA Converter
- 4.3 Oversampling DA converter
- 5 Technical requirements
- 5.1 Temperature
- 5.2 Electrical Characteristics
- 5.3 Packaging characteristics
- 5.4 Other indicators
- 6 Electrical Characteristics Test Method
- 6.1 General instructions
- 6.2 Static characteristics
- 6.3 Dynamic characteristics
- 7 Inspection Rules
- 7.1 General requirements
- 7.2 Inspection classification
- 7.3 Quality Assessment Category
- 7.4 Sampling plan
- 7.5 Inspection lot composition
- 7.6 Appraisal and inspection
- 7.7 Quality consistency inspection
- 7.8 Screening
- 8 flag
- 9 Packaging, transportation and storage
- 9.1 Packaging
- 9.2 Transport
- 9.3 Storage
1 Scope
This document specifies the classification, technical requirements, test methods, and
Inspection rules, marking, packaging, transportation and storage.
This document applies to DA converters designed and manufactured using semiconductor integrated circuit technology.
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.
GB/T 4589.1-2006 Semiconductor devices Part 10.General specifications for discrete devices and integrated circuits
GB/T 4937.3-2012 Mechanical and climatic test methods for semiconductor devices Part 3.External visual inspection
GB/T 4937.4-2012 Mechanical and climatic test methods for semiconductor devices Part 4.Strongly accelerated steady-state damp heat test (HAST)
GB/T 4937.11-2018 Mechanical and climatic test methods for semiconductor devices Part 11.Rapid temperature change double liquid bath method
GB/T 4937.13-2018 Mechanical and climatic test methods for semiconductor devices Part 13.Salt spray
GB/T 4937.14-2018 Mechanical and climatic test methods for semiconductor devices Part 14.Terminal strength (leads are secure sex)
GB/T 4937.15-2018 Mechanical and climatic test methods for semiconductor devices Part 15.Solder resistance of through-hole mounting devices
Receive heat
GB/T 4937.21-2018 Mechanical and climatic test methods for semiconductor devices Part 21.Solderability
GB/T 4937.23 Mechanical and climatic test methods for semiconductor devices Part 23.High temperature operating life
GB/T 4937.26 Mechanical and climatic test methods for semiconductor devices Part 26.Electrostatic discharge (ESD) sensitivity test
Human Body Model (HBM)
GB/T 4937.27 Mechanical and climatic test methods for semiconductor devices Part 27.Electrostatic discharge (ESD) sensitivity test
Machine Model(MM)
GB/T 9178 Integrated circuit terminology
GB/T 12750 Semiconductor device integrated circuits Part 11.Specifications for semiconductor integrated circuits (excluding hybrid circuits)
SJ/T 10147 Integrated circuit anti-static packaging tube
SJ/T 11587 Technical requirements for anti-static packaging of electronic devices
IEC 60749-8.2002 Mechanical and climatic test methods for semiconductor devices Part 8.Sealing (Semiconductor
IEC 60749-9.2017 Mechanical and climatic test methods for semiconductor devices Part 9.Marking durability (Semiconductor
IEC 60749-24.2004 Mechanical and climatic test methods for semiconductor devices Part 24.Steady-state damp heat (Semiconductor […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 30 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 4589.1-2006Semiconductor devices -- Part 10: Generic specification for discrete devices and integrated circuits
- GB/T 4937.3-2012Semiconductor devices -- Mechanical and climatic tests methods -- Part 3: External visual examination
- GB/T 4937.4-2012Semiconductor devices -- Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
- GB/T 4937.11-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method
- GB/T 4937.13-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 13: Salt atmosphere
- GB/T 4937.14-2018Semiconductor devices -- Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
SJ/T 10147 · IEC 60749-8:2002
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Related Standards
GB/T 12750-2006 — Semiconductor devices -- Integrated circuits -- Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 4589.1-2006 — Semiconductor devices -- Part 10: Generic specification for discrete devices and integrated circuits
GB/T 4937.11-2018 — Semiconductor devices -- Mechanical and climatic test methods -- Part 11: Rapid change of temperature -- Two-fluid-bath method
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