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GB/T 39842-2021Itegrated circuit (IC)card packaging framework (English PDF)

集成电路(IC)卡封装框架

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

March 9, 2021

Implementation date

July 1, 2021

Scope

GB/T 39842-2021 is the English-translated version of 集成电路(IC)卡封装框架.

GB/T 39842-2021 is the Chinese national standard for the packaging frame of an integrated circuit card. It gives the technical requirements, the inspection methods, the inspection rules and the provisions on packaging, storage and transport.

It applies to IC card packaging frames, both for contact and for contactless cards. Frame makers and card manufacturers use it. Issued on 9 March 2021, it has applied since 1 July 2021.

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Document preview — GB/T 39842-2021

National Standard of the People's Republic of China

ICS
31.200
Classification
L 56

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • Foreword
  • 1 Scope
  • 2 Normative references
  • 3 Terms and definitions

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009.

1 Scope

This standard specifies the technical requirements, inspection methods, and inspection regulations for integrated circuit (IC) card packaging frameworks (hereinafter referred to as IC card packaging frameworks) Rules, packaging, storage and transportation.

This standard applies to IC card packaging frames, including contact IC card packaging frames and non-contact IC card packaging frames.

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this document. For undated reference documents, the latest version (including all amendments) applies to this document.

GB/T 2423.2 Environmental testing of electric and electronic products Part 2: Test method Test B. High temperature

GB/T 2423.17 Environmental testing of electrical and electronic products Part 2: Test method Test Ka. Salt spray

GB/T 2423.50 Environmental Test Part 2: Test Method Test Cy. Constant damp heat is mainly used for accelerated test of components

GB/T 2423.51-2020 Environmental Test Part 2: Test Method Test Ke. Flowing Mixed Gas Corrosion Test

GB/T 2828.1 Sampling inspection procedure by attributes Part 1: Batch inspection sampling plan retrieved by acceptance quality limit (AQL)

GB/T 3922 Textile color fastness test Color fastness to perspiration

GB/T 13557 Test method for flexible copper clad materials for printed circuits

GB/T 16545-2015 Corrosion of metals and alloys. Removal of corrosion products on corrosion samples

GB/T 16649.2 Identification Card IC Card with Contacts Part 2: Contact Size and Position

GB/T 16921-2005 Metal coating layer thickness measurement X-ray spectrometry

GB/T 17554.1 Identification Card Test Method Part 1: General Characteristic Test

GB/T 25933-2010 high purity gold

GB/T 25934-2010 (all parts) High-purity gold chemical analysis method

GB/T 32642-2016 Method for measuring the surface roughness of flat panel display substrate glass

3 Terms and definitions

The following terms and definitions apply to this document.

3.1 IC card packaging framework

It is laminated with insulating material and conductive material with patterns. It is a carrier to protect the chip and exchange information between the chip and external devices. Interface.

Note: From the data transmission method, it can be divided into single interface contact IC card packaging frame, dual interface contact IC card packaging frame and non-contact IC card packaging frame.

3.2 Single-interface contact IC card packaging framework singlesideICcardpackagingframework

The IC card packaging frame that can only exchange information with external devices can be realized by contact.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 22 pages — is available in the English PDF.

Referenced standards

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