GB/T 35005-2018Test methods for flip chip integrated circuits (English PDF)
集成电路倒装焊试验方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
March 15, 2018
Implementation date
August 1, 2018
Scope
GB/T 35005-2018 is the English-translated version of 集成电路倒装焊试验方法.
GB/T 35005-2018 gives the physical test methods for flip chip integrated circuits. It covers chip bump coplanarity detection, the bump shear test, the flip chip shear test, the flip chip pull-off test, X-ray inspection for solder joint defects and ultrasonic testing for underfill defects.
It defines the terms these methods rely on, including bump, under bump metallization (UBM), flip chip, seating plane, coplanarity, pull force and the clamping fixture that holds the device during shear and pull tests, and refers to GJB 548B-2009 for microelectronic device test methods.
It applies to flip-chip monolithic integrated circuits in ceramic or plastic packages and is used by manufacturers and test laboratories assessing bump and joint quality. It was issued on 15 March 2018 and has applied since 1 August 2018.
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Document preview — GB/T 35005-2018
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L 55
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 Normative references
- 3 Terms and Definitions
- 4 Test method
- 4.1 Chip Bump Coplanarity Detection
- 4.2 Bump Shear Test
- 4.3 Flip Chip Shear Test
- 4.4 Flip-chip pull-off test
- 4.5 X-ray inspection
- 4.6 Ultrasound Testing
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
1 Scope
This standard specifies the bump coplanarity, bump shear force, chip shear pull-off force, solder joint defect, bottom part of the relevant physical test methods such as filling defects.
This standard applies to flip-chip monolithic integrated circuits in ceramic packages or plastic packages.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this document. For undated references, the latest version (including all amendments) applies to this document.
GJB548B-2009 Microelectronic Device Test Methods and Procedures
3 Terms and definitions
The following terms and definitions apply to this document.
3.1 Bump
Printed solder, chemical plating, vapor-deposited solder, electroplated solder, solder head solder, or placement of solder balls spherical or square solder joints.
3.2 Under bump metallization (UBM)
In order to achieve effective interconnection between the solder and the pad, a metal transition layer is deposited on the pad surface.
3.3 Flip chip
Flip chip with bumps and a process technology that directly interconnects the substrate with solder.
3.4 Seating plane
The plane formed by the apexes of the three solder balls has the largest vertical distance from the spherical surface, and the triangle formed by these three vertices should contain the center of gravity of the device.
3.5 Coplanarity
The distance between each bump on the chip and the established reference plane.
3.6 Pull force
Applied to the force of the chip perpendicular to the surface of the device and away from the surface.
3.7 Clamping fixture
Fix the fixture of the device during bump shear, chip shear, chip pull test.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
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