GB/T 34502-2017Gold-coated silver and silver alloy bonding wires for semiconductor package (English PDF)
封装键合用镀金银及银合金丝
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 29, 2017
Implementation date
April 1, 2018
Scope
GB/T 34502-2017 is the English-translated version of 封装键合用镀金银及银合金丝.
GB/T 34502-2017 is the Chinese standard "Gold-coated silver and silver alloy bonding wires for semiconductor package".
Its scope clause reads: This standard specifies the semiconductor package, including discrete devices, integrated circuits, LED packages with gold-plated silver and silver alloy wire requirements, test side Law, inspection rules, marking, packaging, transportation, storage, quality certificate, purchase order (or contract).
This standard applies to semiconductor package bonding with gold-plated silver and silver alloy wire. Its clauses include requirements.
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Document preview — GB/T 34502-2017
National Standard of the People's Republic of China
- ICS
- 77.150.99
- Classification
- H 68
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- 1 Scope
- 2 Normative references
- 3 requirements
- 3.1 product classification
- 3.2 Product Marking Examples
1 Scope
This standard specifies the semiconductor package, including discrete devices, integrated circuits, LED packages with gold-plated silver and silver alloy wire requirements, test side
Law, inspection rules, marking, packaging, transportation, storage, quality certificate, purchase order (or contract).
This standard applies to semiconductor package bonding with gold-plated silver and silver alloy wire.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 10573 non-ferrous metal filament tensile test method
GB/T 11067 (all parts) Silver chemical analysis methods
YS/T 938.4 Chemical analysis of gold and palladium based alloys for dental porcelain repair - Part 4. Determination of gold, platinum, palladium, copper, tin, indium,
Gallium, beryllium, iron, manganese, lithium content Determination of inductively coupled plasma atomic emission spectrometry
3 requirements
3.1 product classification
Products according to different substrates can be divided into gilded silver and gold-plated silver alloy wire two categories, gilded silver wire model HSG, gold-plated silver alloy wire
Base silver content is divided into different AS3, AS6, AS8, AS13 models. Product types, models, status, diameter should be consistent with the provisions of Table 1.
Table 1
Type Model Status Diameter/mm
Gilt silver HSG semi-hard state
0.013, 0.015, 0.016, 0.017, 0.018, 0.019.0.020, 0.021, 0.022, 0.023, 0.024,
0.025, 0.028, 0.030, 0.032, 0.033, 0.035, 0.038, 0.040, 0.042,
0.043, 0.044, 0.045, 0.050
Gold-plated silver alloy wire
AS3 semi-hard state
AS6 semi-hard state
AS8 semi-hard state
AS13 semi-hard state
0.018, 0.020, 0.023, 0.025, 0.030, 0.038
Note. Other diameter products can be produced upon request.
3.2 Product Marking Examples
3.2.1 each gilt silver mark
HSG,
G-Silver (H-Highpurity; S-Silver; G-Gold)
phi - diameter
× - m length […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 17 pages — is available in the English PDF.
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