GB/T 30857-2014Standard test method for thickness and thickness variation on sapphire substrates (English PDF)
蓝宝石衬底片厚度及厚度变化测试方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
July 24, 2014
Implementation date
April 1, 2015
Scope
GB/T 30857-2014 is the English-translated version of 蓝宝石衬底片厚度及厚度变化测试方法.
GB/T 30857-2014 is the Chinese standard "Standard test method for thickness and thickness variation on sapphire substrates".
Its scope clause reads: This standard specifies the sapphire single crystal gallium nitride thin film wafer preparation and other uses cutting, grinding film, polished (referred to as substrate Sheet) thickness and thickness variation whether the standard test method to meet the required limits.
This standard applies to the sapphire substrate thickness and thickness variation tests. Its clauses include terms and definitions; summary of method.
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Document preview — GB/T 30857-2014
National Standard of the People's Republic of China
- ICS
- 77.040
- Classification
- H 21
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- 1 Scope
- 2 Normative references
- 3 Terms and Definitions
- 4 Summary of Method
1 Scope
This standard specifies the sapphire single crystal gallium nitride thin film wafer preparation and other uses cutting, grinding film, polished (referred to as substrate
Sheet) thickness and thickness variation whether the standard test method to meet the required limits.
This standard applies to the sapphire substrate thickness and thickness variation tests.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 14264 semiconductor material terms
3 Terms and Definitions
GB/T 14264 and defined by the following terms and definitions apply to this document.
3.1
5.00 thickness variation
TV5
The difference between the substrate sheet thickness measurements given five points in the maximum and minimum thicknesses of the substrate sheet is called 5-point thickness variation.
4 Summary of Method
4.1 discrete point measurement
In the center of the substrate sheet and the symmetrical positions from the four points on the circumference of the edge 2mm (see Fig. 1) measuring the thickness of the substrate sheet. As a center thickness
The nominal thickness of the substrate sheet. The difference between the five thickness measurements the maximum thickness and the minimum thickness variation is 5.00 thickness of the substrate sheet.
Explanation.
1,4,5 --- from the rounded edges 2mm;
2 --- center;
3 --- anomalies edge 2mm.
Figure 1 discrete position […]
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Cited by
- GB/T 46973-2026Technical specification for high temperature superconducting thin films for microwave passive devices
- GB/T 30858-2025Polished mono-crystalline sapphire substrate wafers
- GB/T 45968-2025Optical near stoichiometric lithium niobate crystal used in quantum information
- GB/T 46611-2025Lithium niobate single-crystal thin film for electro-optic modulators
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