GB/T 16525-2015Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package (English PDF)
半导体集成电路 塑料有引线片式载体封装引线框架规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
May 15, 2015
Implementation date
January 1, 2016
Scope
GB/T 16525-2015 is the English-translated version of 半导体集成电路 塑料有引线片式载体封装引线框架规范.
GB/T 16525-2015 is the Chinese standard "Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package".
Its scope clause reads: This standard specifies the semiconductor integrated circuit plastic leaded chip carrier (PLCC) package lead frame (hereinafter referred to as the lead frame) Technical requirements and inspection rules.
This standard applies to the semiconductor integrated circuit plastic leaded chip carrier (PLCC) the development, production and procurement package lead frame. Its clauses include terms and definitions.
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Document preview — GB/T 16525-2015
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L 56
- Replacing
- GB/T 16525-1996
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Introduction
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 4 technical requirements
- 4.1 size of the lead frame
- 4.2 leadframe shape and position tolerances of
- 4.3 appearance of the lead frame
- 4.4 leadframe plating
- 4.5 intensity of the lead frame outer leads
- 4.6 copper peel test
- 4.7 silver peel test
- 5 Inspection Rules
- 5.2 Qualification approval procedures
- 5.3 Quality conformance inspection
- 6 7 Ordering Information
- 7 signs, packaging, transportation and storage
- 7.1 logo and packaging
- 7.2 Transport, storage
- Appendix A (normative) mechanical measuring lead frame
1 Scope
This standard specifies the semiconductor integrated circuit plastic leaded chip carrier (PLCC) package lead frame (hereinafter referred to as the lead frame)
Technical requirements and inspection rules.
This standard applies to the semiconductor integrated circuit plastic leaded chip carrier (PLCC) the development, production and procurement package lead frame.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 2423.60-2008 Environmental testing for electric and electronic products Part 2. Test methods - Test U. Robustness of terminations and integral security
Attachments strength
GB/T 2828.1-2012 Sampling procedures for inspection - Part 1. by acceptance quality limit (AQL) retrieval batch test sample plan
GB/T 7092 semiconductor integrated circuit Dimensions
GB/T 14112-2015 semiconductor integrated circuit packaging plastic dual-stamped leadframe specification
GB/T 14113 semiconductor integrated circuit package terminology
SJ20129 metal plating layer thickness measurement method
3 Terms and Definitions
Terms and definitions GB/T 14112-2015 and GB/T 14113 apply as defined in this document.
4. Technical Requirements
4.1 leadframe size
Lead frame dimensions should be consistent with the relevant provisions of GB/T 7092, and to comply with the lead frame design.
4.2 leadframe shape and position tolerances
4.2.1 scoliosis
Scoliosis over the entire length of no more than a nominal 0.051mm.
4.2.2 curl
When the thickness of the material is not more than 0.152mm, crimped 2.5 times the material thickness; when the thickness of the material is greater than 0.152mm, the crimp material
2 times the thickness.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Similar standards
Editions of GB/T 16525
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 16525-2015 | Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package | current edition | Current |
| GB/T 16525-1996 | Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package | previous edition | Superseded |
This page sells the current edition, GB/T 16525-2015. Earlier editions are listed for reference only.
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