JB/T 13699.1-2019Electrochemical abrasive wire sawing machines - Part 1: Testing of accuracy (English PDF)
电解磨料线切割机床 第1部分：精度检验
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Issued by
MIIT
Level / Type
Industry · Recommended
Issue date
August 2, 2019
Implementation date
April 1, 2020
Scope
JB/T 13699.1-2019 is the English-translated version of 电解磨料线切割机床 第1部分：精度检验.
JB/T 13699.1-2019 is the recommended machinery industry standard that deals with the testing of accuracy of electrochemical abrasive wire sawing machines.
It names the main components and coordinate axes of the machine, gives the instructions for use, and lays down the geometric accuracy inspection, the positioning accuracy inspection and the machining inspection to be carried out.
The part is written for electrochemical abrasive wire cutting machine tools used to process silicon, germanium and other semiconductor materials, and its use is not limited to them.
The inspection work quotes GB/T 1958-2017, GB/T 17421.1-1998, GB/T 17421.2-2016, GB/T 30860-2014 and GB/T 30869-2014. Issued on 2 August 2019, it has applied since 1 April 2020.
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Document preview — JB/T 13699.1-2019
National Standard of the People's Republic of China
- ICS
- 25.120.40; 25.080.99
Issued by: Ministry of Industry and Information Technology of the People's Republic of China
Contents
- Foreword
- Scope
- Normative references
- About this standard
- Related standards
- Classification and status
1 Foreword
JB/T 13699.1-2019 was issued by MIIT on 2 August 2019 and has been in force since 1 April 2020.
It is one of 2 parts of the JB/T 13699 series.
2 Scope
This standard is the recommended machinery industry standard that deals with the testing of accuracy of electrochemical abrasive wire sawing machines. It names the main components and coordinate axes of the machine, gives the instructions for use, and lays down the geometric accuracy inspection, the positioning accuracy inspection and the machining inspection to be carried out. The part is written for electrochemical abrasive wire cutting machine tools used to process silicon, germanium and other semiconductor materials, and its use is not limited to them. The inspection work quotes GB/T 1958-2017, GB/T 17421.1-1998, GB/T 17421.2-2016, GB/T 30860-2014 and GB/T 30869-2014.
3 Normative references
JB/T 13699.1-2019 cites the following standards, which apply in full or in part through the references made to them in its clauses.
GB/T 1958-2017 — Geometrical Product Specifications(GPS)—Geometrical tolerance—Verification
GB/T 17421.1-1998
GB/T 17421.2-2016
GB/T 30860-2014 — Test methods for surface roughness and saw mark of silicon wafers for solar cells
GB/T 30869-2014 — Test method for thickness and total thickness variation of silicon wafers for solar cell
4 About this standard
Issued by: MIIT
English translation: about 15 pages
5 Related standards
Other parts of this standard:
JB/T 13699.2-2019 — Part 2: Technical requirements
6 Classification and status
International classification (ICS): 25.120.40; 25.080.99
Prefix JB/T: recommended standard.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 1958-2017Geometrical Product Specifications(GPS)—Geometrical tolerance—Verification
- GB/T 17421.1-1998Test code for machine tools - Part 1: Geometric accuracy of machines operating under no-load or quasi-static conditions
- GB/T 17421.2-2016Test code for machine tools - Part 2: Determination of accuracy and repeatability of positioning of numerically controlled axes
- GB/T 30860-2014Test methods for surface roughness and saw mark of silicon wafers for solar cells
- GB/T 30869-2014Test method for thickness and total thickness variation of silicon wafers for solar cell
Similar standards
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Related Standards
GB/T 1958-2017 — Geometrical Product Specifications(GPS)—Geometrical tolerance—Verification
GB/T 30860-2014 — Test methods for surface roughness and saw mark of silicon wafers for solar cells
GB/T 30869-2014 — Test method for thickness and total thickness variation of silicon wafers for solar cell
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JB/T 13699.1-2019
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