GB/T 30860-2014Test methods for surface roughness and saw mark of silicon wafers for solar cells (English PDF)

1 Scope

This standard specifies a solar cell wafers (hereinafter referred to as wafer) surface roughness and cutting line marks the contact or non-contact wheel

Profile test methods.

This standard applies to cut through the line of processing technology monocrystalline and polycrystalline silicon wafer. If you need to apply to other products, it would take all relevant

Parties agreed.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein

Member. For undated references, the latest edition (including any amendments) applies to this document.

GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values

GB/T 3505 Geometrical product specifications (GPS) Surface texture Profile method - Terms, definitions and surface texture parameters

GB/T 10610 Geometrical product specifications (GPS) Surface texture Profile method - Rules and procedures for evaluation of the surface structure

GB/T 14264 semiconductor material terms

GB/T 18777 Geometrical product specifications (GPS) Surface texture Profile method - Metrological characteristics of phase correct filters

GB/T 26071 monocrystalline silicon solar cells with a cutting disc

GB /Z26958 (all parts) Geometrical product specifications (GPS) filter

GB/T 29055 multicrystalline silicon wafers for solar cells

GB/T 29505 flat surface of a silicon wafer surface roughness measurement method

GB/T 30859 solar cell wafer warpage and waviness testing methods

3 Terms and Definitions

GB/T 1031, GB/T 3505, GB/T 10610, GB/T 14264, GB/T 18777, GB/T 26071, GB/T 29055 and

GB /Z26958 defined terms and definitions apply to this document.

4 principle of the method