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GB/T 40577-2021Terminology for integrated circuit (IC) manufacturing equipment (English PDF)

集成电路制造设备术语

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

October 11, 2021

Implementation date

May 1, 2022

Scope

GB/T 40577-2021 is the English-translated version of 集成电路制造设备术语.

GB/T 40577-2021 is the Chinese vocabulary of terms for the equipment used to manufacture integrated circuits.

It begins with basic reliability terms such as availability, maintainability, MTBF, MTTR and MTTF, and then defines the terms for crystal growth and processing equipment, mask making equipment, lithography and etching equipment, doping equipment, thin film deposition equipment, cleaning equipment, packaging equipment and test equipment, closing with the parts common to many machines.

An index lists every term. It is intended for the design, development, production and use of IC manufacturing equipment, and for research, teaching and publishing in the field, so that manufacturers, fabs and authors describe the same machines with the same words. It was issued on 11 October 2021 and has applied since 1 May 2022.

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Document preview — GB/T 40577-2021

National Standard of the People's Republic of China

ICS: 31.220
Classification: L 95

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Foreword
1 Scope
2 Normative references
3 Basic terminology
4 Crystal growth processing equipment
5 Mask manufacturing equipment
6 Lithography and etching equipment
7 Doping equipment
8 Thin film deposition equipment
9 Cleaning equipment
10 Packaging equipment
11 Testing equipment
12 Common parts

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.

1 Scope

This document specifies the basic and commonly used terms of integrated circuit (IC) manufacturing equipment, including basic terms, crystal growth processing equipment, masks Terminology and common parts of manufacturing equipment, lithography and etching equipment, doping equipment, thin film deposition equipment, cleaning equipment, packaging equipment, testing equipment the term.

This document applies to the design, development, production and application of integrated circuit manufacturing equipment, as well as the scientific research and teaching of integrated circuit manufacturing equipment. Study and publishing work.

2 Normative references

There are no normative references in this document.

3 Basic terminology

3.1 Reliability

Under specified conditions, the ability of a device to perform its predetermined functions within a certain period of time.

3.2 Availability

When needed, the device is in the possibility of performing its predetermined functions.

3.3 Maintainability

The possibility that the equipment remains in or restored to a state capable of performing its predetermined functions within a specified time.

3.4 Mean time between failures; MTBF

The average time between two adjacent failures of the repairable product.

Note: MTBF is also known as "mean time between failures", which is a measure of the reliability of equipment, the unit is "hours (h)", which means that the equipment is guaranteed within a specified time An ability to sustain function.

3.5 Mean time to repair; MTTR

The average value of the time required for repairable products from failure to repair.

3.6 Mean time to failure; MTTF

The average time the system can operate normally.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 41 pages — is available in the English PDF.

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