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GB/T 41213-2021Integrated circuit full automatic die bonder (English PDF)

集成电路用全自动装片机

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

December 31, 2021

Implementation date

July 1, 2022

Scope

GB/T 41213-2021 is the English-translated version of 集成电路用全自动装片机.

GB/T 41213-2021 is the Chinese national standard for fully automatic die bonders used in integrated circuit packaging. It covers the machine's structure, classification, model and basic parameters, and the working conditions it needs: cleanliness, humidity, temperature, anti-static protection, power, compressed air and vacuum.

Its requirements and matching test methods address the transfer and bonding mechanisms, the image recognition system, the wafer table, the ejector pin and dispensing mechanisms, unloading, the electrical and software parts and safety.

It also sets type and factory inspection rules and marking, packaging, transport and storage. Equipment makers and packaging plants use it for design and acceptance. It was issued on 31 December 2021 and has applied since 1 July 2022.

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Document preview — GB/T 41213-2021

National Standard of the People's Republic of China

ICS: 31.220
Classification: L 95

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Preface
1 Scope
2 Normative references
3 Terms and Definitions
4 Product structure, classification, model and basic parameters
4.1 Structure
4.2 Category
4.3 Type
4.4 Basic parameters
5 Working conditions
5.1 Cleanliness
5.2 Relative humidity
5.3 Ambient temperature
5.4 Anti-static requirements
5.5 Power Requirements
5.6 Equipment Current Requirements
5.7 Compressed air pressure and flow requirements
5.8 Vacuum pressure requirements
6 Requirements
6.1 Appearance
6.2 Transfer mechanism
6.3 Welding mechanism
6.4 Image Recognition System
6.5 Wafer table
6.6 Thimble mechanism
6.7 Dispensing mechanism
6.8 Blanking mechanism
6.9 Electrical section
6.10 Software Part
6.11 Safety requirements
7 Test method
7.1 Appearance
7.2 Transfer mechanism
7.3 Welding mechanism
7.4 Image Recognition System
7.5 Wafer table
7.6 Thimble mechanism
7.7 Dispensing mechanism
7.8 Blanking mechanism
7.9 Electrical inspection
7.10 Software Detection
7.11 Product Safety
8 Inspection rules
8.1 Inspection classification
8.2 Type inspection
8.3 Factory inspection
9 Marking, Packaging, Shipping and Storage
9.1 Flags
9.2 Packaging
9.3 Transport
9.4 Storage

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1. Structure and Drafting Rules of Standardization Documents" drafted.

1 Scope

This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods and inspection regulations of the automatic chip loader for integrated circuits. regulations, marking, packaging, transportation and storage.

This document applies to fully automatic chip loaders for integrated circuit packaging.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document.

GB/T 191 Graphical signs of packaging, storage and transportation

GB/T 5226.1-2019 Mechanical and Electrical Safety Mechanical and Electrical Equipment Part 1. General Specifications

GB/T 13306 Signs

GB 50073-2013 Design code for clean workshop

3 Terms and Definitions

The following terms and definitions apply to this document.

3.1 Wafer

Silicon wafers used in the fabrication of integrated circuits.

Note 1. The shape is circular.

Note 2. It can be processed into various circuit element structures on silicon wafers, and become semiconductor products such as ICs and discrete devices with specific electrical functions.

3.2 Scribing film tape

The film remaining after the wafer is cut and the protective film is removed.

Note: It plays the role of supporting and fixing the chip.

3.3 Carrier

A kind of electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire, etc.) It is a key structural part of the electrical circuit.

Note 1. Including lead frame, substrate and ceramic plate, etc.

Note 2. It acts as a bridge to connect with external wires.

3.4 Pressure force

The pick-up pressure to pick up the die from the wafer and the solder pressure to attach the die to the carrier.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

Normative references

Similar standards

GB/T 15428-1995|GB/T 12992-1991|GB/T 12993-1991|GB/T 43368-2023|GB/T 8446.2-2022|GB/T 15872-2013

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