GB/T 15879.616-2026Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (English PDF)
半导体器件的机械标准化 第6-16部分：焊球阵列封装（BGA）、焊盘阵列封装（LGA）、密节距焊球阵列封装（FBGA）和密节距焊盘阵列封装（FLGA）的半导体试验和老化插座术语表
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
August 28, 2026
Implementation date
March 1, 2027
Scope
GB/T 15879.616-2026 is the English-translated version of 半导体器件的机械标准化 第6-16部分：焊球阵列封装（BGA）、焊盘阵列封装（LGA）、密节距焊球阵列封装（FBGA）和密节距焊盘阵列封装（FLGA）的半导体试验和老化插座术语表.
Test and burn-in sockets hold semiconductor packages during electrical testing and stress screening. This document is Part 6-16 of the series on mechanical standardization of semiconductor devices and provides a glossary of terms for such sockets used with BGA, LGA, FBGA and FLGA packages. These are area-array package types in which connections are made through solder balls or lands on the underside of the device. It adopts an international standard.
It is useful to socket manufacturers, semiconductor test and packaging houses, device makers that qualify products by burn-in, test equipment designers, and technical writers or translators who need consistent terminology. A shared glossary reduces ambiguity in specifications and supplier communication.
The document is a recommended (GB/T) standard and is voluntary unless cited in a contract or other binding document. It was issued on 28 August 2026 and takes effect on 1 March 2027.
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Document preview — GB/T 15879.616-2026
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L55
Issued by: State Administration for Market Regulation; Standardization Administration of China
Contents
- Foreword
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
Foreword
GB/T 15879.616-2026 is a recommended national standard (GB/T) of the People's Republic of China, issued on 28 August 2026 by the State Administration for Market Regulation and the Standardization Administration of China, with effect from 1 March 2027.
The document adopts an international standard (ISO or IEC).
It is under the responsibility of the Ministry of Industry and Information Technology (Electronics).
Classification: ICS 31.200; CCS L55.
1 Scope
Test and burn-in sockets hold semiconductor packages during electrical testing and stress screening. This document is Part 6-16 of the series on mechanical standardization of semiconductor devices and provides a glossary of terms for such sockets used with BGA, LGA, FBGA and FLGA packages. These are area-array package types in which connections are made through solder balls or lands on the underside of the device. It adopts an international standard.
It is useful to socket manufacturers, semiconductor test and packaging houses, device makers that qualify products by burn-in, test equipment designers, and technical writers or translators who need consistent terminology. A shared glossary reduces ambiguity in specifications and supplier communication.
The document is a recommended (GB/T) standard and is voluntary unless cited in a contract or other binding document. It was issued on 28 August 2026 and takes effect on 1 March 2027.
Remaining clauses in the full document
- 2 Normative references
- 3 Terms and definitions
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 17 pages — is available in the English PDF.
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Related Standards
GB/T 15879.618-2026 — Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
GB/T 15879.613-2026 — Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
GB/T 15879.620-2026 — Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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GB/T 15879.616-2026
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