GB/T 15879.613-2026Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (English PDF)
半导体器件的机械标准化 第6-13部分：密节距焊球阵列封装（FBGA）和密节距焊盘阵列封装（FLGA）顶部开放式插座的设计指南
Also coversGB/T15879.613-2026 + GBT15879.613-2026
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
August 28, 2026
Implementation date
March 1, 2027
Scope
GB/T 15879.613-2026 is the English-translated version of 半导体器件的机械标准化 第6-13部分：密节距焊球阵列封装（FBGA）和密节距焊盘阵列封装（FLGA）顶部开放式插座的设计指南.
Test and burn-in sockets allow fine-pitch ball grid array and land grid array packages to be connected without soldering. This document is Part 6-13 of the series on mechanical standardization of semiconductor devices and provides a design guideline for open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA) packages.
Socket manufacturers can use it to align their designs with a common outline, and semiconductor makers and test houses may refer to it when specifying the sockets used for device qualification and production test. Board designers who need to plan for a socketed device can also benefit from a shared mechanical reference. As the title says, it is a guideline, and it is a recommended national standard that adopts an international standard. It was issued on 28 August 2026 and takes effect on 1 March 2027.
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Document preview — GB/T 15879.613-2026
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L55
Issued by: State Administration for Market Regulation; Standardization Administration of China
Contents
- Foreword
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
Foreword
GB/T 15879.613-2026 is a recommended national standard (GB/T) of the People's Republic of China, issued on 28 August 2026 by the State Administration for Market Regulation and the Standardization Administration of China, with effect from 1 March 2027.
The document adopts an international standard (ISO or IEC).
It is under the responsibility of the Ministry of Industry and Information Technology (Electronics).
Classification: ICS 31.200; CCS L55.
1 Scope
Test and burn-in sockets allow fine-pitch ball grid array and land grid array packages to be connected without soldering. This document is Part 6-13 of the series on mechanical standardization of semiconductor devices and provides a design guideline for open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA) packages.
Socket manufacturers can use it to align their designs with a common outline, and semiconductor makers and test houses may refer to it when specifying the sockets used for device qualification and production test. Board designers who need to plan for a socketed device can also benefit from a shared mechanical reference. As the title says, it is a guideline, and it is a recommended national standard that adopts an international standard. It was issued on 28 August 2026 and takes effect on 1 March 2027.
Remaining clauses in the full document
- 2 Normative references
- 3 Terms and definitions
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 20 pages — is available in the English PDF.
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Related Standards
GB/T 15879.616-2026 — Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
GB/T 15879.612-2025 — Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
GB/T 15879.618-2026 — Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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GB/T 15879.613-2026
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