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SJ/T 11200-2016Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method (English PDF)

环境试验 2-58部分：试验试验Td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法

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Issued by

Ministry of Industry and Information Technology

Level / Type

National · Recommended

Issue date

April 5, 2016

Implementation date

September 1, 2016

Scope

SJ/T 11200-2016 is the English-translated version of 环境试验 2-58部分：试验试验Td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法.

SJ/T 11200-2016 — This standard applies to surface-assembled components and provides standard test methods for solderability of lead-free solder, eutectic or near-eutectic tin-lead solder, corrosion resistance of metallized layers, and solder heat resistance.

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Document preview — SJ/T 11200-2016

National Standard of the People's Republic of China

ICS: 19.040
Classification: A 21
Replacing: SJ/T 11200-1999

Issued by: Ministry of Industry and Information Technology

What this standard covers1
Document data2

What this standard covers

This standard applies to surface-assembled components and provides standard test methods for solderability of lead-free solder, eutectic or near-eutectic tin-lead solder, corrosion resistance of metallized layers, and solder heat resistance. It is specified that when the solder bath method is not applicable, the test is performed by reflow soldering.

Document data

International classification (ICS): 19.040.

Chinese classification (CCS): A21.

Estimated length of the Chinese original: 20,271 words.

Adopted international standard: IEC 60068-2-58:2004, MOD.

Supersedes the earlier edition SJ/T 11200-1999.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 13 pages — is available in the English PDF.

Referenced standards

Cited by

GB/T 45660-2025Electronics assembly technology - Electronic modules

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