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GB/Z 34954.2-2026Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime (English PDF)

航空电子过程管理电子器件使用性能第2部分：半导体集成电路寿命

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

July 2, 2026

Implementation date

July 2, 2026

Scope

GB/Z 34954.2-2026 is the English-translated version of 航空电子过程管理电子器件使用性能第2部分：半导体集成电路寿命.

GB/Z 34954.2-2026 is the Chinese standard "Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime".

Its scope clause reads: This document outlines how original equipment manufacturers (OEMs) can use off-the-shelf semiconductor integrated circuit products (COTS) for high-performance, high-reliability applications.

Reliability and long lifespan applications. This document is applicable to OEMs planning and maintaining Semiconductor Electronic Components Management Programs (ECMPs).

This document describes a process and methodology for selecting digital semiconductor integrated circuits to ensure their lifespan meets aerospace, defense, and high-performance applications.

Requirements for Advanced Performance Hierarchy Processes (ADHP) applications (typically related to functional environments). This document provides information on ADHP applications in aerospace, defense, and high performance hierarchies.

In applications, reliability assessment methods and guidelines for semiconductor integrated circuits (COTS) are provided; these methods and guidelines are primarily applied to the electronic design stage.

The next stage involves the selection and reliability assessment of semiconductor integrated circuits (COTS). This document focuses on COTS (Chip-on-Semiconductor Integrated Circuits) with feature sizes less than or equal to 90 nm [also known as deep submicron (DSM)].

The core of the law. Note 1.IEC 62239-1 can assist OEMs in planning and maintaining ECMP. Note 2.The SAE ARP6338 can help OEMs assess and mitigate early wear and tear on semiconductor integrated circuits with limited lifespan.

Note 3.With the development of electronic technology and semiconductor integrated circuits with feature sizes less than or equal to 90 nm, semiconductor electronic components exhibit constant...

The assumptions of (random) failure rate and no lifetime limitation or wear and tear mean that the MIL-HDBK-217 manual or FIDES guidelines are no longer applicable.

Silicon has a very low basic failure rate (FIT), and the main failure modes typically occur in the package (e.g., case, bonding wires, etc.). Its clauses include terms, definitions and abbreviations.

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Document preview — GB/Z 34954.2-2026

National Standard of the People's Republic of China

ICS: 49.025
Classification: V 25

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

1.Scope1
2 Normative references1
3.Terms, Definitions and Abbreviations1
3.1 Terms and Definitions1
3.2 Abbreviations3
4.1 Overview4
4.2 Input Parameters6
4.3 Lifespan requirements during the mission6
4.4 Lifetime Assessment of Semiconductor Integrated Circuits (COTS) Based on OCM Information6
4.5 Lifetime Assessment of OEM-Manufactured Semiconductor Integrated Circuits (COTS)7
4.6 Lifetime Calculation of Semiconductor Integrated Circuits (COTS) in the Mission8
4.7 Mission-time compliance of semiconductor integrated circuit COTS9
4.8 Solution Optimization and Alternative Solutions9
4.9 Final Report10
5.Considerations for assessing the aging level of semiconductor integrated circuits10
Appendix A (Informative) Failure and Degradation Mechanisms of COTS (Chip-on-Semiconductor Integrated Circuits)11
Appendix B (Informative) Example of Operating and Thermal Performance Profiles for Semiconductor Integrated Circuit COTS12
Appendix D (Informative) BEOL and FEOL Process Parameters14
Appendix E (Informative) General Acceleration Model15
Appendix F (Informative) Final Report16
References18

1 Scope

This document outlines how original equipment manufacturers (OEMs) can use off-the-shelf semiconductor integrated circuit products (COTS) for high-performance, high-reliability applications.

Reliability and long lifespan applications. This document is applicable to OEMs planning and maintaining Semiconductor Electronic Components Management Programs (ECMPs).

This document describes a process and methodology for selecting digital semiconductor integrated circuits to ensure their lifespan meets aerospace, defense, and high-performance applications.

The next stage involves the selection and reliability assessment of semiconductor integrated circuits (COTS).

This document focuses on COTS (Chip-on-Semiconductor Integrated Circuits) with feature sizes less than or equal to 90 nm [also known as deep submicron (DSM)].

The core of the law.

Note 1.IEC 62239-1 can assist OEMs in planning and maintaining ECMP.

Note 2.The SAE ARP6338 can help OEMs assess and mitigate early wear and tear on semiconductor integrated circuits with limited lifespan.

Note 3.With the development of electronic technology and semiconductor integrated circuits with feature sizes less than or equal to 90 nm, semiconductor electronic components exhibit constant...

The assumptions of (random) failure rate and no lifetime limitation or wear and tear mean that the MIL-HDBK-217 manual or FIDES guidelines are no longer applicable.

Silicon has a very low basic failure rate (FIT), and the main failure modes typically occur in the package (e.g., case, bonding wires, etc.).

2 Normative references

This document has no normative references.

3 Terms, Definitions and Abbreviations

3.1 Terms and Definitions

The following terms and definitions apply to this document.

3.1.1 Acceleration model

An equation used to predict the relationship between failure time and working stress.

Note 1.The accelerated model demonstrates how to use the failure time at a specific operating stress level to predict the equivalent failure time at different operating stress levels.

Note 2.An accelerated model is associated with a failure and degradation mode or mechanism. An accelerated model can be defined as being influenced by temperature, electrical, mechanical, environmental, or other factors that may affect the equipment.

Stress that compromises reliability.

Note 3.The acceleration model is semi-empirical and primarily based on failure physics. Time is typically determined by the modeled failure time distribution (log-normal distribution, Weibull distribution).

(e.g., distribution, exponential distribution).

3.1.2 Bipolar CMOS; Bi-CMOS

The technology of integrating two separate semiconductors, bipolar transistors and off-the-shelf (COTS) transistors, into a single electronic component.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.

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