GB/T 4909.12-2009Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method (English PDF)
裸电线试验方法 第12部分：镀层可焊性试验-焊球法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
March 19, 2009
Implementation date
December 1, 2009
Scope
GB/T 4909.12-2009 is the English-translated version of 裸电线试验方法 第12部分：镀层可焊性试验-焊球法.
GB/T 4909.12-2009 is the Chinese standard "Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method". Its scope clause reads: GB/T 4909 provisions of this part of the test equipment of bare wire ball method solderability test, sample preparation, measurement procedures, tests Evaluation results and the like.
This section applies to testing tinned copper surface by molten solder wetting characteristics, this characteristic is represented by a specific time.
This part of the method is to use a sample of molten solder ball split in half, cut the measurement sample flows into the solder balls to four weeks and the test sample Comp time live coverage required.
This time indicates the solderability of the specimen. This section should be used in conjunction with the GB/T 4909.1-2009. Its clauses include test equipment.
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Document preview — GB/T 4909.12-2009
National Standard of the People's Republic of China
- ICS
- 29.060.10
- Classification
- K 11
- Replacing
- GB/T 4909.12-1985
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- 1 Scope
- 2 Normative references
- 3 Test Equipment
- 3.1 solderability test device
1 Scope
GB/T 4909 provisions of this part of the test equipment of bare wire ball method solderability test, sample preparation, measurement procedures, tests
Evaluation results and the like.
This section applies to testing tinned copper surface by molten solder wetting characteristics, this characteristic is represented by a specific time.
This part of the method is to use a sample of molten solder ball split in half, cut the measurement sample flows into the solder balls to four weeks and the test sample
Comp time live coverage required. This time indicates the solderability of the specimen.
This section should be used in conjunction with the GB/T 4909.1-2009.
2 Normative references
The following documents contain provisions which, through reference to GB/T 4909 to the present, constitute provisions of this section. For dated reference documents
Member, all subsequent amendments (not including errata content) or revisions do not apply to this section, however, encouraged to reach under this section
Parties to research agreement to use the latest versions of these documents. For undated reference documents, the latest versions apply to this section.
GB/T 4909.1-2009 Test methods for bare wires - Part 1. General
3 Test Equipment
3.1 solderability test device
As shown in Figure 1. Design and manufacture of test equipment should be able to guarantee the thermal head temperature maintained at (235 ± 2) °C.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Similar standards
Editions of GB/T 4909.12
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 4909.12-2009 | Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method | current edition | Current |
| GB/T 4909.12-1985 | Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method | previous edition | Superseded |
This page sells the current edition, GB/T 4909.12-2009. Earlier editions are listed for reference only.
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Related Standards
GB/T 4909.1-2009 — Test methods for bare wires - Part 1: General
GB/T 4909.10-2009 — Test methods for bare wires - Part 10: Test for continuity of coating - Ammonium persulphate solution method
GB/T 4909.11-2009 — Test methods for bare wires - Part 11: Test for adherence of coating
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GB/T 4909.12-2009
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