GB/T 47837.4017-2026Materials for printed circuit boards and other interconnecting structures - Part 4-17: Prepreg for multilayer printed circuit boards - Non-halogenated epoxide woven E-glass prepreg for lead-free assembly (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 4-17 of GB/T 47837 "Materials for Printed Circuit Boards and Other Interconnect Structures". GB/T 47837 has been issued.

The following parts were laid out.

---Part 4-12.Halogen-free multifunctional epoxy E-glass fiber cloth adhesive sheets for multilayer printed circuit boards;

---Part 4-16.Lead-free lead-free assembly adhesive sheets for multilayer printed circuit boards; Halogen-free multifunctional epoxy E-glass fiber cloth adhesive sheets;

---Part 4-17.Bonding Sheets for Multilayer Printed Circuit Boards - Halogen-Free Epoxy E Fiberglass Cloth Bonding Sheets for Lead-Free Assembly this document is modified to adopt IEC 61249-4-17:2009 "Materials for printed circuits and other interconnects - Part 4-17.Copper-free".

Adhesive sheet.

This document has undergone significant structural adjustments compared to IEC 61249-4-17:2009.A table comparing the structural numbering of the two documents is provided below.

See Appendix A.

This document differs significantly from IEC 61249-4-17:2009.The differences are indicated in the margins of the relevant clauses.

Vertical single lines (|) are indicated. A summary of these technical differences and their reasons is provided in Appendix B.

The following editorial changes have been made to this document.

---The standard name has been changed to "Materials for Printed Circuit Boards and Other Interconnect Structures Part 4-17.Adhesives for Multilayer Printed Circuit Boards".

"Halogen-free epoxy E-glass fiber cloth bonding sheet for lead-free packaging";

---The description of the corresponding IEC product model for this adhesive sheet in Chapter 1 has been deleted;

---The device sections of Chapters 3, 4, and 5 of IEC 61249-4-17:2009 are moved to sections 4.1, 5.1.1, and 5.1.1 of this document, respectively.

5.1.2;

---Change 4.1.3 to skewness and move it to 5.1.8 skewness, consistent with the existing national standard writing format, and consistent with the test in Table 2.

The order of methods corresponds;

---Adjust the curing thickness from 4.3.4 to 5.4.1;

---In accordance with the description in GB/T 33015, 5.1.1 unwetted area is changed to un-wetted area;

---The title of Chapter 6 has been changed from "Delivery Status" to "Dimensions," and Chapter 6 has been moved to section 5.2 to align with the existing national standard format.

The requirements for shear sheets are incorporated into the dimensions of sheet-like adhesive sheets, and different dimensional requirements are specified. Additionally, requirements for the perpendicularity of sheet-like adhesive sheets are added.

---The title of Chapter 8 has been changed from "Storage" to "Transportation and Storage";

---The references in IEC 61249-4-17:2005 have been removed;

---This document has deleted any content related to sample preparation requirements that overlaps with GB/T 33016-2016.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47).

Introduction

The materials used in printed circuit boards (PCBs) and other interconnect structures are diverse, their technical specifications are complex, and their applications are constantly evolving with technological advancements.

Changes cannot be fully and clearly covered by a single standard, requiring comprehensive technical rules and requirements for all materials. Therefore, GB/T 47837 "Printing Standards" was established.

The "Materials for Circuit Boards and Other Interconnect Structures" series of standards aims to comprehensively cover materials used in PCBs and other interconnect structures, as well as related testing methods.

The law clarifies the boundaries of each technical specification and facilitates the maintenance and updating of standards.

"Materials for Printed Circuit Boards and Other Interconnect Structures Part 4: Adhesive Sheets for Multilayer Printed Circuit Boards" aims to establish applicable materials for multilayer printed circuit boards.

The manufacturing, inspection specifications, and acceptance criteria for adhesive sheets used in printed circuit boards are proposed to consist of 10 parts.

---Part 4-2.Multifunctional epoxy E-fiberglass cloth adhesive sheet for multilayer printed circuit boards. The purpose is to standardize the curing process.

Development and manufacturing of multifunctional epoxy E fiberglass cloth bonding sheets with a glass transition temperature of 150°C~170°C (excluding 170°C).

The use of these technologies and methods will better ensure the quality of the product, facilitate material selection for downstream customers, and promote the sustainable development of the electronic circuit industry.

Development of modified or unmodified polyimide E fiberglass cloth bonding sheets with a glass transition temperature of not less than 150°C after standard curing.

Manufacturing, use, and other processes will better ensure the quality of the product, facilitate material selection for downstream customers, and promote the sustainable development of the electronic circuit industry.

develop.

---Part 4-11.Halogen-free epoxy E-fiberglass cloth adhesive sheets for multilayer printed circuit boards. The purpose is to standardize the curing process of the fiberglass cloth.

Development, manufacturing, and use of halogen-free epoxy E-glass fiber cloth bonding sheets with a glass transition temperature of 120°C~150°C (excluding 150°C).

This will better ensure the quality of the product, facilitate material selection for downstream customers, and promote the sustainable development of the electronic circuit industry.

---Part 4-12.Halogen-free multifunctional epoxy E-glass fiber cloth adhesive sheets for multilayer printed circuit boards. The purpose is to standardize adhesive bonding...

The development of halogen-free multifunctional epoxy E fiberglass cloth bonding sheet products with a glass transition temperature of 150°C~170°C (excluding 170°C) after tempering.

This facilitates the development, manufacturing, and use of the product, better ensuring its quality, facilitating material selection for downstream customers, and promoting the sustainable development of the electronic circuit industry.

develop.

---Part 4-14.Epoxy E-fiberglass cloth adhesive sheets for lead-free assembly of multilayer printed circuit boards. The purpose is to standardize adhesive bonding...

Opening of lead-free epoxy E fiberglass cloth bonding sheet products with a glass transition temperature of 120°C~150°C (excluding 150°C) after tempering.

This facilitates the development, manufacturing, and use of the product, better ensuring its quality, facilitating material selection for downstream customers, and promoting the sustainable development of the electronic circuit industry.

develop.

---Part 4-15.Multifunctional Epoxy E-Fiberglass Cloth Adhesive Sheets for Lead-Free Assembly of Multilayer Printed Circuit Boards. The purpose is to...

Lead-free multifunctional epoxy E-glass fiber cloth adhesive with a glass transition temperature of 150°C~170°C (excluding 170°C) after standard curing.

The development, manufacturing, and use of wafer-glued products will better ensure product quality, facilitate material selection for downstream customers, and promote the development of the electronics industry.

The continued development of the road industry.

---Part 4-16.Lead-free lead-free halogen-free multifunctional epoxy E-glass fiber cloth adhesive sheets for multilayer printed circuit boards. Purpose the development, manufacturing, and use of fiberglass cloth bonding sheets will better ensure product quality, facilitate material selection for downstream customers, and promote...

To promote the continued development of the electronic circuit industry.

---Part 4-17.Lead-free halogen-free epoxy E-glass fiber cloth adhesive sheets for lead-free assembly of multilayer printed circuit boards. The purpose is to regulate...

Lead-free, halogen-free epoxy E-glass fiber cloth bonding sheet with a glass transition temperature of 120°C~150°C (excluding 150°C) after curing.

The development, manufacturing, and use of products better ensure product quality, facilitate material selection for downstream customers, and promote the development of electronic circuit products.

The industry's continued development.

---Part 4-18.High-performance epoxy E-glass fiber cloth adhesive sheets for lead-free assembly of multilayer printed circuit boards. The purpose is to...

Development of high-performance epoxy E fiberglass cloth bonding sheets for lead-free packaging with a glass transition temperature of not less than 170°C after standard curing.

Manufacturing, use, and other processes will better ensure the quality of the product, facilitate material selection for downstream customers, and promote the sustainable development of the electronic circuit industry.

develop.

---Part 4-19.High-performance halogen-free epoxy E-glass fiber cloth adhesive sheets for lead-free assembly of multilayer printed circuit boards. Purpose the product is a high-performance halogen-free epoxy E-glass fiber cloth bonding sheet with a glass transition temperature of not less than 170°C after standard curing.

The development, manufacturing, and use of products will better ensure product quality, facilitate material selection for downstream customers, and promote the development of the electronics circuit industry.

Its continued development.

Materials for printed circuit boards and other interconnect structures Parts 4-17.Adhesive Sheets for Multilayer Printed Circuit Boards Lead-free packaging with halogen-free epoxy E fiberglass cloth adhesive sheet

1 Scope

This document specifies the material and structure, performance and methods, and quality assurance requirements for halogen-free epoxy E fiberglass cloth bonding sheets used in lead-free assembly.

Production and inspection of fabric bonding sheets (referred to as bonding sheets).

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

GB/T 2036 Printed Circuit Terminology GB/T 16483 Contents and Item Order of Safety Data Sheets for Chemicals GB/T 18373 E-fiberglass cloth for printed circuit boards GB/T 19001 Quality Management System Requirements (GB/T 19001-2016, ISO 9001:2015, IDT) GB/T 24001 Environmental Management Systems Requirements and Guidance for Use (GB/T 24001-2016, ISO 14001:2015, IDT) GB/T 33015-2016 General Rules for Bonding Sheets for Multilayer Printed Circuit Boards GB/T 33016-2016 Test methods for bonding sheets for multilayer printed circuit boards GB/T 44295-2024 Epoxy E fiberglass cloth bonding sheet for multilayer printed circuit boards (IEC 61249-4-1:2008, MOD) Note. The content referenced in GB/T 44295-2024 is not technically different from the content referenced in IEC 61249-4-1:2008.

3 Terms and Definitions

The terms and definitions defined in GB/T 2036 and GB/T 33015-2016 apply to this document.

4 Structure and Materials