GB/T 43972-2024Remote operation and maintenance of integrated circuit packaging equipment - Status monitoring (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting: Please note that some of the contents of this document may involve patents: The issuing organization of this document does not assume the responsibility for identifying patents: This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203): This document was drafted by: China Electronics Technology Group Corporation Second Research Institute, China Electronics Technology Group Corporation Fourteenth Research Institute, China The 38th Institute of Electronic Technology Group Corporation, Nanjing Solid State Devices Co:, Ltd:, Mechanical Industry Instrumentation and Metering Comprehensive Technical and Economic Research Institute, Qingdao Kairui Electronics Co:, Ltd:, China Electronics Technology Group Corporation No:

13 Research Institute, Shenyang Heyan Technology Co:, Ltd:, Changzhou Mingsai Robotics Technology Co:, Ltd:, Shanghai Xuantian Industrial Equipment Co:, Ltd:, Suzhou Weijia Technology Co:, Ltd:, Guangdong Chengtai Transportation Science and Technology Technology Development Co:, Ltd:, Shanghai Shiyu Precision Equipment Co:, Ltd:, Haige Oyim (Tianjin) Electronics Co:, Ltd:, Dongke Semiconductor (An Hui) Co:, Ltd:, Shenzhen Hengchangtong Electronics Co:, Ltd:, Zhejiang Nanomicro Technology Co:, Ltd:, Inner Mongolia Xianhong Technology Co:, Ltd: Jiangsu Shangda Semiconductor Co:, Ltd:, Shenzhen Desen Precision Equipment Co:, Ltd:, China Electronics Pengcheng Intelligent Equipment Co:, Ltd:, Sanhe Jianhua Hi-Tech Limited Liability Company, Dongguan Kunpeng Bojue Machinery Equipment Co:, Ltd:, Shanghai Xiewei Environmental Technology Co:, Ltd:, Jiangsu Jilai Microelectronics Co:, Ltd: Co:, Ltd:, Jiangsu Deyi Xiangyu Optoelectronics Technology Co:, Ltd:, Shenzhen Nuotaixin Equipment Co:, Ltd:, Jiangsu Napes Semiconductor Co:, Ltd: Shenzhen Jingdao Electronics Co:, Ltd:, Shanghai Pudat Semiconductor Equipment Co:, Ltd:, Beijing Ansheng Technology Co:, Ltd:, Shenzhen Saiyuan Microelectronics Co:, Ltd: Electronics Co:, Ltd:, Tianjin Jinya Electronics Co:, Ltd:, Enaki Intelligent Technology Wuxi Co:, Ltd:, Wuxi Xinxiang Information Technology Co:, Ltd: Jiangsu Kuakexin Equipment Technology Co:, Ltd:, Hangzhou Tuoer Microelectronics Co:, Ltd:, Jigan Semiconductor Equipment (Nantong) Co:, Ltd:, Wuxi Science & Technology Vocational College of Technology, Shenzhen Biaopu Semiconductor Technology Co:, Ltd:, Chengdu Jiujin Technology Co:, Ltd:, Suzhou Zhicheng Semiconductor Technology Co:, Ltd: Company, Jiangsu Fulehua Semiconductor Technology Co:, Ltd:, Suzhou Ecoris Intelligent Equipment Co:, Ltd:, Shenzhen Han's Packaging and Testing Technology Co:, Ltd: Technology Co:, Ltd:, Shenzhen Zhaoxing Botuo Technology Co:, Ltd:, Shenzhen Gangxianghui Electronics Co:, Ltd:, Mingde Runhe Machinery Manufacturing (Tianjin) Co:, Ltd: The main drafters of this document are: Chao Yuqing, Tian Fang, Guo Yongzhao, Guo Lei, Lü Qipeng, Yan Dong, Fang Yifang, Chen Zhenyu, Cheng Kai, Li Wenjun, Huang Yafei, Peng Di, Zhang Yongcong, Duan Yunsen, Zhang Mingming, Li Changfeng, Chen Yuanming, Guan Lingqian, Huang Wenqing, Zhao Kai, Zhai Bo, Xie Yong, Tang Haitao, Kong Jianping, Wu Kuisheng, Sun Bin, Zhou Lin, Wang Mingxin, Lü Lei, Qian Zhaopeng, Wang Fuqing, Xu Zhifeng, Zhang Peng, Liu Rongkun, Li Hui, Yuan Quan, Lai Huipeng, Huang Yunwen, Liu Yifan, Cheng Junjian, Wu Yuanbing, Zheng Zhongwei, Jin Xingxun, Qi Guoqiang, Zhao Qidong, Lin Haitao, Yao Ziyang, Xiong Yajun, Zhou Keji, Yang Shipin, Li Yan, Wang Chi, Zhu Shaode, Luo Yunfei, Wang Gang, Zhou Lei:

The integrated circuit packaging process is used to protect the structure of the integrated circuit from external influences and ensure the final electrical, optical, thermal and The mechanical properties are normal: The integrated circuit packaging process is complicated, and the packaging process equipment is to ensure that the integrated circuit is completed reliably and stably: Typical integrated circuit packaging equipment includes mechanical punching machine, screen printing machine, grinding wheel dicing machine, chip mounter, lead wire Bonding machines, etc: As integrated circuit packaging equipment develops towards digitalization, networking, and intelligence, remote operation and maintenance is the key to ensure the quality of integrated circuit packaging equipment: Remote operation and maintenance can realize the reliable operation, improve equipment working efficiency and extend equipment life: Compared with traditional operation and maintenance methods, remote operation and maintenance can establish data collection, condition monitoring, fault identification and diagnosis, and predictive maintenance in the production process: A more effective monitoring and alarm mechanism is established, which saves manpower and material costs, improves the reliability of production equipment and production processes, and realizes the Automatic control and intelligent management: Among them, status monitoring runs through the entire remote operation and maintenance process, through remote real-time monitoring of the operating parameters of integrated circuit packaging equipment, timely Detect abnormal conditions and make early warnings and alarms, realize network, remote and visual management of equipment; users only need to log in to the client to understand On-site information, to understand the real-time status of equipment operation, maintenance requirements and performance status, and to adjust equipment operating parameters without going to the production site Settings and other operations: The purpose of compiling this document is to unify the relevant requirements for the remote operation and maintenance of integrated circuit packaging equipment: Users have a basis to rely on, so as to achieve more accurate maintenance and management of integrated circuit packaging equipment, promote the equipment to function more effectively, and improve Application efficiency: Remote operation and maintenance of integrated circuit packaging equipment Condition Monitoring

1 Scope

GB/T 43972-2024 covers the condition monitoring part of remote operation and maintenance for integrated circuit packaging equipment. A packaging line runs die bonders, wire bonders and moulding presses continuously, and an unplanned stop costs both the throughput and the work in progress; the equipment makers are often far from the fab, sometimes in another country, so the diagnosis has to be made from telemetry rather than from a visit. The standard sets the architecture of the condition monitoring system and the main monitoring process, defines the objects monitored - the equipment itself and its operating environment - and the data collection, then the preconditions for monitoring, covering the characteristics of the monitoring parameters, their classification, the choice of monitoring method and the measurement intervals, followed by the condition monitoring process and its requirements, the analysis and alarm handling, and the data and security requirements. It took effect on 1 November 2024.

This document specifies the system architecture, main processes, monitoring objects, data collection, monitoring Relevant requirements for setting pre-test conditions and status monitoring process: This document is applicable to typical integrated circuit packaging such as mechanical punching machine, screen printing machine, grinding wheel dicing machine, chip mounter, wire bonding machine, etc: The operation status monitoring of equipment remote operation and maintenance can also be used as a reference for remote operation and maintenance status monitoring of equipment in other electronic component production lines:

2 Normative references

The contents of the following documents constitute the essential clauses of this document through normative references in this document: For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document:

GB/T 43796-2024 Integrated circuit packaging equipment remote operation and maintenance data collection

3 Terms and definitions

The following terms and definitions apply to this document: 3:

1 The process of remotely realizing functions such as operation and maintenance object data collection, status monitoring, fault mode identification, and predictive maintenance through the network: [Source: GB/T 43796-2024, 3:1] 3:2 status monitoring By monitoring, analyzing and judging certain characteristic parameters of the monitored object, we can check whether its working state is normal or abnormal, and The process of issuing early warnings or alarms in a timely manner, publishing visual monitoring results, and providing information for further fault identification: 3:

3 Monitored parameters The quantitative characteristic value determined for the purpose of monitoring reflects the actual operating status of the equipment:

4 Abbreviations

The following abbreviations apply to this document: AR:Augmented Reality MR: Mixed Reality VR: Virtual Reality