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GB/T 43538-2023Quality and technical requirements for metal packages used for integrated circuits (English PDF)

集成电路金属封装外壳质量技术要求

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

December 28, 2023

Implementation date

July 1, 2024

Scope

GB/T 43538-2023 is the English-translated version of 集成电路金属封装外壳质量技术要求.

GB/T 43538-2023 is the Chinese national standard covering quality and technical requirements for metal packages used for integrated circuits. Issued on 28 December 2023, it has been in force since 1 July 2024.

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Document preview — GB/T 43538-2023

National Standard of the People's Republic of China

ICS: 31.200
Classification: L 55

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceIII
1 Scope1
2 Normative references1
3 Terms and Definitions1
4 Technical requirements5
4:1 Materials5
4:2 Plating5
4:3 Design and structure5
4:4 Electrical properties5
4:5 Appearance quality6
4:6 Environmental adaptability6
Appendix A (normative) Coating quality test method7
A:1 Gold plating layer quality test method7
A:2 Nickel plating quality test method7
Appendix B (Normative) Metal casing appearance quality requirements9
B:1 Quality Requirements9
B:2 Inspection conditions29

Foreword

This document complies with the provisions of GB/T 1:1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting:

Please note that some content in this document may be subject to patents: The publisher of this document assumes no responsibility for identifying patents:

This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China:

This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78):

This document was drafted by: China Electronics Technology Standardization Institute, Guangdong Gaozhi Emerging Industry Development Research Institute, Hefei Shengda Electronic Technology Technology Industrial Co:, Ltd:, Hebei Zhongci Electronic Technology Co:, Ltd:, Qingdao Kairui Electronics Co:, Ltd:, Guangdong Zhongshaoxuan Standardization Technology Research Institute Co:, Ltd:, Shenzhen Qiyue Technology Co:, Ltd:

The main drafters of this document: An Qi, Huang Zhigang, Hu Haitao, Zhao Jing, Chen Xiangbo, Cui Congjun, and Chang Shousheng:

Technical requirements for the quality of integrated circuit metal packaging casings

1 Scope

This document specifies the materials, plating, design and structure, electrical characteristics, appearance quality and environmental adaptability of integrated circuit metal packaging casings:

technical requirements and inspection methods:

This document applies to the development, production, delivery and use of integrated circuit metal packaging casings (hereinafter referred to as "casings"):

2 Normative reference documents

GB/T 4937

GB/T 16526

GB/T 19248

IEC 60749

3 Terms and definitions

The following terms and definitions apply to this document: 3:1 wall sidewall The inner surface of the housing that forms the sealed cavity:

NOTE: Contains and protects product circuitry with connections extending to leads inside the enclosure: 3:2 base The main support area at the bottom of the enclosure:

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 27 pages — is available in the English PDF.

Referenced standards

Normative references

IEC 60749

Editions of GB/T 43538

Edition	Title	Revision	Status
GB/T 43538-2023	Quality and technical requirements for metal packages used for integrated circuits	current edition	Current

This page sells the current edition, GB/T 43538-2023. Earlier editions are listed for reference only.

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