GB/T 43227-2023Test methods for space vapour deposition protective film on semiconductor wire (English PDF)
宇航用集成电路内引线气相沉积保护膜试验方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 7, 2023
Implementation date
January 1, 2024
Scope
GB/T 43227-2023 is the English-translated version of 宇航用集成电路内引线气相沉积保护膜试验方法.
This document specifies the method for inspecting the vapour deposited protective film applied to semiconductor devices for space use, together with the electrical and mechanical environmental test methods.
The document applies to the testing of space integrated circuits on which the vapour deposited protective film has been completed.
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Document preview — GB/T 43227-2023
National Standard of the People's Republic of China
- ICS
- 49.040
- Classification
- A 29
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Foreword
- 1 Scope
- 2 Normative reference documents
- 3 Terms and definitions
- 4 Environmental conditions
- 5 Inspection methods for vapor deposition protective films
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.
1 Scope
This document specifies the vapor deposition protective film inspection method and electrical Mechanical environment test methods.
This document is applicable to the testing of aerospace integrated circuits that have completed vapor deposition protective films.
2 Normative reference documents
This document has no normative references.
3 Terms and definitions
The following terms and definitions apply to this document.
3.1 Vapour deposited protective film
The integrated circuit is placed in a special vacuum equipment, the vapor deposition material is cracked into free radicals at high temperature, and then the integrated circuit is added to the integrated circuit at room temperature.
The internal structure surface of the road is vapor deposited and polymerized to form an insulating coating.
4 Environmental conditions
All test methods listed in this document should be carried out under the following environmental conditions.
a) Temperature. 18°C~28°C;
b) Relative humidity. 30%~70%.
5 Inspection methods for vapor deposition protective films
5.1 Internal visual inspection
5.1.1 Purpose
For aerospace integrated circuits packaged using the vapor deposition process, the effect of the protective film should be checked, as well as whether the protective film and the inside of the circuit cavity are Damage exists.
5.1.2 Equipment
The equipment used in the test should be able to prove whether the device meets the corresponding requirements, including inspection at low magnification of 40 times to 100 times, high magnification Optical equipment can be inspected at 100x to 200x magnification.
5.1.3 Samples
Aerospace integrated circuits that have completed the vapor deposition process should undergo internal visual inspection.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
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