GB/T 43136-2023Superabrasive products—Precision dicing and cutting wheels for semiconductor chips (English PDF)
超硬磨料制品 半导体芯片精密划切用砂轮
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 7, 2023
Implementation date
April 1, 2024
Scope
GB/T 43136-2023 is the English-translated version of 超硬磨料制品 半导体芯片精密划切用砂轮.
This document specifies the precision dicing and cutting wheels used on semiconductor chips: the product classification, the product designation, the technical requirements, the test methods, the inspection rules, and the marking, packaging, transport and storage.
The document applies to electroplated, resin-bonded and metal-bonded diamond wheels used for the precision dicing of semiconductor wafers and the precision cutting of packaged chips.
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Document preview — GB/T 43136-2023
National Standard of the People's Republic of China
- ICS
- 25.100.70
- Classification
- J 43
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- PrefaceI
- 1 Scope
- 2 Normative reference documents
- 3 Terms and Definitions
- 4 Product Category
- 4.1 Grinding wheel for precision dicing of wafer chips
- 4.2 Grinding wheel for precision cutting of package chips
- 5 product marking
- 5.1 Grinding wheel markings for precision dicing of wafer chips
- 5.2 Grinding wheel markings for precision cutting of package chips
- 6 Technical requirements
- 6.1 Appearance
- 6.2 Basic size limit deviation
- 6.3 Geometric tolerance
- 6.4 Substrate roughness
- 7 Test method
- 7.1 Appearance
- 7.2 Basic dimensions
- 7.3 Geometric tolerance
- 7.4 Substrate roughness
- 8 Inspection rules
- 8.1 Factory inspection
- 8.2 Product quality supervision and inspection
- 9 flag
- 9.1 Product Marking
- 9.2 Certificate mark
- 9.3 Outer packaging mark
- 10 Packaging, transportation and storage
- 10.1 Packaging
- 10.2 Transport
- 10.3 Storage
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents" Drafting.
1 Scope
This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, Marking, packaging, shipping and storage.
This document applies to electroplating bonding agents, resin bonding agents and metals used for precision dicing of semiconductor wafer chips and precision cutting of package chips. Bonded diamond grinding wheel.
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.
GB/T 1800.2-2020 Product Geometric Specification (GPS) Linear Dimensional Tolerance ISO Code System Part 2: Standard Tolerance zone code and limit deviation table of holes and shafts
GB/T 2829-2002 Periodic inspection counting sampling procedures and tables (applicable to inspection of process stability)
GB/T 16458 Abrasives Terminology
3 Terms and definitions
The terms and definitions defined in GB/T 16458 apply to this document.
4 Product categories
4.1 Grinding wheel for precision dicing of wafer chips
The product code is SWDW. The bond type is electroplating bond.
The shape code is 3A2 (hub type), the shape is shown in Figure 1, and the dimensions are shown in Table 1.
Figure 1 Schematic diagram of the shape of the grinding wheel (type 3A2) used for precision dicing of wafer chips
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 1800.2-2020Geometrical product specifications (GPS) - ISO code system for tolerances on linear sizes - Part 2: Tables of standard tolerance classes and limit deviations for holes and shafts
- GB/T 2829-2002Sampling procedures and tables for periodic inspection by attributes
- GB/T 16458Terminology for abrasives and abrasive products
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Related Standards
GB/T 16458.1-1996 — Terminology for abrasives and abrasive products
GB/T 16458-2021 — Terminology for abrasives and abrasive products
GB/T 1800.2-2020 — Geometrical product specifications (GPS) - ISO code system for tolerances on linear sizes - Part 2: Tables of standard tolerance classes and limit deviations for holes and shafts
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