GB/T 44687-2024Superabrasive products—Precision grinding wheels for semiconductor wafers (English PDF)

超硬磨料制品半导体晶圆精密磨削用砂轮

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 29, 2024

Implementation date

April 1, 2025

Scope

GB/T 44687-2024 is the English-translated version of 超硬磨料制品半导体晶圆精密磨削用砂轮.

GB/T 44687-2024 is the Chinese national standard covering the diamond wheels that chamfer the edge of a semiconductor wafer and thin its back face — the two product families and the groove forms of the abrasive layer, the product marking, the limit deviations on the basic dimensions and the geometric tolerances, the roughness of the matrix, the dynamic balancing and the rotational strength that a wheel has to survive at working speed, and the inspection and packaging. First edition, under the China Machinery Industry Federation. In force from 1 April 2025. Issued on 29 September 2024, it has been in force since 1 April 2025.

Document preview — GB/T 44687-2024

National Standard of the People's Republic of China

ICS: 25.100.70
Classification: J 43

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceIII
1 Scope1
2 Normative references1
3 Terms and Definitions1
4 Product Categories1
4.1 Grinding wheels for precision grinding of wafer edge chamfering (hereinafter referred to as “chamfering grinding wheels”)1
4.2 Grinding wheels for wafer end surface thinning precision grinding (hereinafter referred to as “thinning grinding wheels”)3
5 Product Marking12
5.1 Chamfering grinding wheel12
5.2 Thinning grinding wheel12
6 Technical Requirements1212
6.1 Appearance12
6.2 Limit deviations of basic dimensions13
6.3 Geometric tolerances15
6.4 Matrix roughness15
6.5 Dynamic balancing15
6.6 Rotational strength15
7 Test methods15
7.1 Appearance15
7.2 Basic size16
7.3 Geometric tolerances16
7.4 Matrix roughness17
7.5 Dynamic balancing17
7.6 Rotational strength17
8 Inspection rules17
9 Sign17
9.1 Product Labelling1717
9.2 Certificate of Conformity17
9.3 Outer packaging marking17
10 Packaging, transportation and storage18
10.1 Packaging18
10.2 Transportation1818
10.3 Storage18

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed by the China Machinery Industry Federation.

This document is under the jurisdiction of the National Technical Committee for Standardization of Abrasives and Grinding Tools (SAC/TC139).

This document was drafted by: Zhengzhou Abrasives and Grinding Research Institute Co., Ltd., Jiangsu Saiyang Precision Technology Co., Ltd., Huaqiao University, Beijing Antai Steel Research Institute Superhard Materials Products Co., Ltd., Jiangsu Sanjing Semiconductor Materials Co., Ltd., Qingdao Gaoce Technology Co., Ltd.

Co., Ltd., Guangdong Benlang New Materials Co., Ltd.

The main drafters of this document are: Bao Hua, Zhao Yanjun, Chen Weidong, Huang Guoqin, Liu Yibo, Zou Yuyao, Zhang Xiutao, Tao Hongliang, Gu Chunqing, Han Xin, Ding Yulong, Li Guowei, Niu Junkai, Zhang Liang, Ye Tengfei, Wang Lihua, Zhu Liang, Yang Songbin, Yin Yulong. Super abrasive products Grinding wheels for precision grinding of semiconductor wafers

1 Scope

This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, Labeling, packaging, transportation and storage.

This document applies to metal bonds, resin bonds and ceramic bonds used for precision grinding of semiconductor wafer edge chamfering and end face thinning.

Diamond grinding wheels with porcelain bond and composite bond.

2 Normative references

GB/T 1800.2-2020

GB/T 2493

GB/T 9239.1

GB/T 16458

GB/T 35479

3 Terms and definitions

The terms and definitions defined in GB/T 16458 apply to this document.

4 Product Categories

4.1 Grinding wheel for precision grinding of wafer edge chamfering (hereinafter referred to as “chamfering grinding wheel”)

4.1.1 Abrasive layer groove type

The groove type and code of the abrasive layer are shown in Table 1.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 1800.2-2020 · GB/T 9239.1 · GB/T 35479

Editions of GB/T 44687

Edition	Title	Revision	Status
GB/T 44687-2024	Super abrasive products - Precision grinding wheels for semiconductor wafers	current edition	Current

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