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GB/T 43087-2023Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials (English PDF)

微束分析分析电子显微术层状材料截面像中界面位置的确定方法

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 7, 2023

Implementation date

April 1, 2024

Scope

GB/T 43087-2023 is the English-translated version of 微束分析分析电子显微术层状材料截面像中界面位置的确定方法.

GB/T 43087-2023 is the Chinese standard "Microbeam analysis - Analytical electron microscopy - Method for the determination of interface position in the cross-sectional image of the layered materials".

Its scope clause reads: This document specifies a method for the determination of the average interface position between two different materials recorded using cross-sectional images of layered materials.

This document is applicable to cross-sectional images of layered materials recorded by transmission electron microscopy (TEM) or scanning transmission electron microscopy (STEM). and the cross-sectional element surface distribution map recorded by X-ray energy spectrometer (EDS) or electron energy loss spectrometer (EELS).

Also suitable for digital The digital image collected by the camera, computer memory and imaging board image sensor, and the analog image recorded on the film are converted into a digital image by the scanner.

This document does not apply to the determination of interface positions obtained by the multilayer simulation method (MSS). Note.

When the contrast difference on both sides of the interface in the TEM image/STEM image is small, it will cause the pixel intensity to oscillate violently, and the noise generated will affect the average interface position. judgment.

Its clauses include normative reference documents; terms, definitions and symbols.

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Document preview — GB/T 43087-2023

National Standard of the People's Republic of China

ICS: 71.040.50
Classification: N33

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Preface
Introduction
1 Scope
2 Normative reference documents
3 Terms, definitions and symbols
3.1 Terms and definitions
3.2 Symbol
4 Preparation of cross-section specimens
4.1 General
4.2 Requirements for cross-section samples
5 Determination of interface location
5.1 Overview
5.2 Preparation
6 Interface position determination step
6.1 Overview
6.2 Obtaining cross-sectional TEM images/STEM images
6.3 ROI settings
6.4 Obtaining the mean intensity curve
6.5 Moving average processing
6.6 Differential processing
6.7 Determination of interface location
7 Uncertainty
7.1 Uncertainties accumulated at various steps in the process
7.2 Uncertainty of measurement results in image analysis
Appendix A (informative) Processing examples of three types of actual TEM images/STEM images
Appendix B (informative) Two main applications of this method
Appendix C (Informative) Calibration of ruler units. Calibration of pixel size

1 Scope

This document specifies a method for the determination of the average interface position between two different materials recorded using cross-sectional images of layered materials.

This document is applicable to cross-sectional images of layered materials recorded by transmission electron microscopy (TEM) or scanning transmission electron microscopy (STEM).

and the cross-sectional element surface distribution map recorded by X-ray energy spectrometer (EDS) or electron energy loss spectrometer (EELS). Also suitable for digital

The digital image collected by the camera, computer memory and imaging board image sensor, and the analog image recorded on the film are converted into a digital image by the scanner.

This document does not apply to the determination of interface positions obtained by the multilayer simulation method (MSS).

Note. When the contrast difference on both sides of the interface in the TEM image/STEM image is small, it will cause the pixel intensity to oscillate violently, and the noise generated will affect the average interface position.

judgment.

2 Normative reference documents

This document has no normative references.

3 Terms, definitions and symbols

3.1 Terms and definitions

The following terms and definitions apply to this document.

3.1.1 cross-sectionalimage

TEM image/STEM image of multi-layer materials along the direction perpendicular to the stacking direction.

3.1.2

Calculates the difference between adjacent pixel data in an intensity distribution plot.

3.1.3 digital

By chip array image sensors [such as charge coupled device (CCD) or complementary metal oxide semiconductor (CMOS) sensors, see

3.17] A device that converts visual images into electrical signals.

[Source. GB/T 34002-2017, 3.8, with modifications]

3.1.4

An image generated from the signal of a selected specific element on an EDS/EELS spectrum.

3.1.5 filtering mask

Mask defining the cutoff frequency in reciprocal space.

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 41 pages — is available in the English PDF.

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GB 38031-2025|GB/T43087-2023|GB/T 1.1-2020|GB/T 34002-2017|GB/T 22062|GB/T 32387|GB/T 23414|GB/T 17722

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