GB/T 42709.38-2026Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 38 of GB/T 42709 "Semiconductor Devices - Microelectromechanical Devices". GB/T 42709 has been published as follows.

Part 2.

---Part 2: Tensile Testing Methods for Thin Film Materials;

---Part 3: Standard test pieces for tensile testing of thin films;

---Part 6: Axial fatigue testing methods for thin film materials;

---Part 7: MEMS Bulk Acoustic Filters and Duplexers for RF Control and Selection;

---Part 8: Bending Test Methods for Measuring the Tensile Properties of Strip Films;

---Part 12: Bending fatigue testing method for thin film materials using MEMS structural resonance method;

---Part 19: Electronic Compass;

---Part 21: Methods for Measuring Poisson's Ratio in MEMS Thin Film Materials;

---Part 22: Electromechanical Tensile Testing Methods for Conductive Thin Films on Flexible Substrates;

---Part 29: Electromechanical relaxation test methods for suspended conductive films at room temperature;

---Part 35: Methods for testing the electrical properties of flexible MEMS devices under bending deformation;

---Part 36: Environmental and Dielectric Permeability Testing Methods for MEMS Piezoelectric Thin Films;

---Part 38: Test Method for Adhesion Strength of Metal Powder Paste in MEMS Interconnects;

---Part 40: Threshold testing method for MEMS inertial shock switches.

This document is equivalent to IEC 62047-38:2021 "Semiconductor devices – Microelectromechanical devices – Part 38: MEMS interconnects".

Test method for adhesion strength of metal powder paste.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document was prepared by the National Integrated Circuit Standardization Technical Committee (SAC/TC599) and the National Microelectromechanical Technology Standardization Technical Committee.

(SAC/TC336) are jointly under the jurisdiction of the State Administration of Taxation.

Introduction

This document describes a test method for the adhesion strength of metal powder paste in MEMS interconnects, applicable to metal powder paste in MEMS interconnects.

Bulk adhesion strength testing. Clarifying the applicable scope and characteristics of metal powder paste adhesion strength testing in MEMS interconnects, including terms, definitions, and symbols.

The parameters and testing methods, etc., are helpful in better guiding professionals in related industries in product development, testing, and use. GB/T 42709 the book "Semiconductor Devices and Microelectromechanical Devices" is planned to consist of 23 parts.

---Part 2: Tensile Testing Methods for Thin Film Materials. The purpose is to specify tensile testing methods for MEMS thin film materials.

---Part 3: Standard Test Pieces for Tensile Testing of Thin Films. The purpose is to specify the test pieces for tensile testing of MEMS thin film materials.

Relevant requirements.

---Part 5: Radio Frequency MEMS Switches. The purpose is to define the terminology, characteristic requirements, and test methods for radio frequency MEMS switches.

Laws, etc.

---Part 6: Axial Fatigue Testing Methods for Thin Film Materials. The purpose is to specify axial fatigue testing methods for MEMS thin film materials.

method.

---Part 7: MEMS Bulk Acoustic Filters and Duplexers for RF Control and Selection. The purpose is to specify MEMS bulk acoustic filters and duplexers.

Terminology, characteristics, and testing methods for acoustic resonators, filters, and duplexers.

---Part 8: Bending Test Method for Measuring the Tensile Properties of Strip Films. The purpose is to specify the method for measuring the tensile properties of strip films.

A bending test method for sexuality.

---Part 9: Measurement of inter-wafer bonding strength. The purpose is to specify the testing methods for the bonding strength of MEMS wafers.

---Part 11: Test method for the linear thermal expansion coefficient of materials in suspended microelectromechanical systems. The purpose is to specify the linear thermal expansion coefficient of materials in suspended microelectromechanical systems.

---Part 12: Bending fatigue testing method for thin film materials using MEMS structural resonance. The purpose is to specify the testing method for MEMS thin film materials.

Methods for testing the bending fatigue of membrane materials.

---Part 13: Bending and Shear Test Methods for the Adhesion Strength of MEMS Structures. The purpose is to specify the adhesion strength of MEMS structures.

Strength test method.

---Part 16: Test methods for residual stress in MEMS films based on wafer curvature and cantilever beam deflection. The purpose is to specify the testing methods for MEMS films.

Two test methods were used. residual stress wafer curvature and cantilever beam deflection.

---Part 19: Electronic Compass. The purpose is to define the terminology, characteristics, and testing methods for electronic compasses.

---Part 21: Methods for Measuring Poisson's Ratio of MEMS Thin Film Materials. The purpose is to specify methods for measuring the Poisson's ratio of MEMS thin film materials.

method.

---Part 22: Electromechanical Tensile Testing Methods for Conductive Thin Films on Flexible Substrates. The purpose is to specify the electromechanical tensile testing methods for conductive thin film materials in MEMS.

Electrical property tensile testing method.

---Part 26: Description and Measurement Methods for Microgrooves and Needle Structures. The aim is to specify the description and measurement methods for MEMS microgrooves and needle structures.

Description and experimental methods.

---Part 27: Miniature V-T Test (MCT) Method for Measuring Bond Strength of Glass Slurry. The purpose is to specify the bonding strength of glass slurry...

The MCT test method for composite strength.

---Part 29: Electromechanical Relaxation Test Methods for Suspended Conductive Thin Films at Room Temperature. The purpose is to specify the electromechanical relaxation test methods for suspended conductive thin films in MEMS devices.

Electromechanical relaxation test method for thin films at room temperature.

---Part 32: Nonlinear Vibration Testing Methods for MEMS Resonators. The purpose is to define the nonlinear vibration characteristics of MEMS resonators.

Performance testing methods.

Methods for testing electrical properties under bending deformation.

---Part 36: Environmental and Dielectric Permeability Testing Methods for MEMS Piezoelectric Thin Films. The purpose is to specify the environmental and dielectric withstand voltage testing methods for MEMS piezoelectric thin films.

Environmental and dielectric withstand performance test methods.

---Part 38: Test Method for Adhesion Strength of Metal Powder Paste in MEMS Interconnects. The purpose is to specify the adhesion strength of metal powder paste in MEMS interconnects.

This is a test method for the adhesion strength of powders and pastes.

---Part 40: Threshold Test Methods for MEMS Inertial Shock Switches. The purpose is to specify the threshold values for MEMS inertial shock switches.

Test method.

---Part 44: Testing Methods for Dynamic Characteristics of MEMS Resonant Electric Field Sensing Devices. The purpose is to specify methods for evaluating and determining...

Terminology, definitions, and testing methods for the dynamic performance of MEMS resonant electric field sensitive devices.

Semiconductor devices and microelectromechanical devices Part 38: Metal Powder Paste in MEMS Interconnects Adhesion strength test method

1 Scope

This document describes a test method for assessing the adhesion strength of metal powder paste in electrical interconnections between MEMS devices and circuit boards. Metal powder Typical examples of pastes include anisotropic conductive pastes, solder pastes, and nanoscale metallic inks. This document applies to metallic powders with diameters ranging from [insert diameter range here].

Various metal powder pastes ranging from 10µm to 500µm.

This document simulates applying a uniaxial compressive load to a metal powder paste using a glass lens in a real MEMS device, followed by a return through the lens.

The adhesion strength is measured by applying a load during the removal process. This document applies to cases considering the actual contact between MEMS devices and metal powder particles.

Adhesion strength analysis scenario based on area.

This document has no normative references.

3 Terms and Definitions

The following terms and definitions apply to this document.

The URLs for the terminology databases maintained by ISO and IEC for standardization are as follows.

Contact load

The pre-set force when the lens comes into contact with the metal powder paste.

Note. The unit of contact load is Newton (N).

Maximum pulling force PC the maximum tensile force that the specimen can withstand.

Note. The unit of maximum tensile force is Newton (N).

AMP

When a contact load (PL) is applied, the contact area is formed solely by the metal powder.

Note. The unit for the contact area containing only metal powder is square meters (m2).