GB/T 42709.12-2026Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 12 of GB/T 42709 "Semiconductor Devices - Microelectromechanical Devices". GB/T 42709 has been published as follows.

Part 2.

---Part 2: Tensile Testing Methods for Thin Film Materials;

---Part 3: Standard test pieces for tensile testing of thin films;

---Part 5: Radio Frequency MEMS Switches;

---Part 6: Axial fatigue testing methods for thin film materials;

---Part 8: Bending Test Methods for Measuring the Tensile Properties of Strip Films;

---Part 12: Bending fatigue testing method for thin film materials using MEMS structural resonance method;

---Part 19: Electronic Compass;

---Part 21: Methods for Measuring Poisson's Ratio in MEMS Thin Film Materials;

---Part 22: Electromechanical Tensile Testing Methods for Conductive Thin Films on Flexible Substrates;

---Part 29: Electromechanical relaxation test methods for suspended conductive films at room temperature;

---Part 35: Methods for testing the electrical properties of flexible MEMS devices under bending deformation;

---Part 36: Environmental and Dielectric Permeability Testing Methods for MEMS Piezoelectric Thin Films;

---Part 38: Test Method for Adhesion Strength of Metal Powder Paste in MEMS Interconnects;

---Part 40: Threshold testing method for MEMS inertial shock switches.

This document is equivalent to IEC 62047-12:2011 "Semiconductor devices – Microelectromechanical devices – Part 12: Semiconductor devices using MEMS junctions".

A structural resonance method for testing the bending fatigue of thin film materials.

The following minimal editorial changes have been made to this document.

---The index numbers for Figures 1, A.2, B.2, and C.2 are included in the figures.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document was prepared by the National Integrated Circuit Standardization Technical Committee (SAC/TC599) and the National Microelectromechanical Technology Standardization Technical Committee.

(SAC/TC336) are jointly under the jurisdiction of the State Administration of Taxation.

Introduction

GB/T 42709 "Semiconductor Devices and Microelectromechanical Devices" is proposed to consist of the following parts.

---Part 2: Tensile Testing Methods for Thin Film Materials. The purpose is to specify tensile testing methods for MEMS thin film materials.

---Part 3: Standard Test Pieces for Tensile Testing of Thin Films. The purpose is to specify the test pieces for tensile testing of MEMS thin film materials.

Relevant requirements.

---Part 5: Radio Frequency MEMS Switches. The purpose is to define the terminology and definitions, characteristic requirements, and testing procedures for radio frequency MEMS switches.

Methods, etc.

---Part 6: Axial Fatigue Testing Methods for Thin Film Materials. The purpose is to specify axial fatigue testing methods for MEMS thin film materials.

method.

---Part 7: MEMS Bulk Acoustic Filters and Duplexers for RF Control and Selection. The purpose is to specify MEMS bulk acoustic filters and duplexers.

Terminology and definitions, characteristic requirements, and test methods for acoustic resonators, filters, and duplexers.

---Part 8: Bending Test Method for Measuring the Tensile Properties of Strip Films. The purpose is to specify the method for measuring the tensile properties of strip films.

A bending test method for sexuality.

---Part 9: Measurement of inter-wafer bonding strength. The purpose is to specify the testing methods for the bonding strength of MEMS wafers.

---Part 11: Test method for the linear thermal expansion coefficient of materials in suspended microelectromechanical systems. The purpose is to specify the linear thermal expansion coefficient of materials in suspended microelectromechanical systems.

Method for testing the linear thermal expansion coefficient of MEMS materials.

Methods for testing the bending fatigue of membrane materials.

---Part 13: Bending and Shear Test Methods for Bond Strength of MEMS Structures. The purpose is to specify the bonding strength of MEMS structures.

Strength test method.

---Part 16: Test methods for wafer curvature and cantilever beam deflection of residual stress in MEMS films. The purpose is to specify the methods for measuring the residual stress in MEMS films.

Two test methods were used. wafer curvature and cantilever beam deflection to measure residual stress in the membrane.

---Part 19: Electronic Compass. The purpose is to define the terminology and definitions, characteristic requirements, and test methods for electronic compasses.

---Part 21: Methods for Measuring Poisson's Ratio of MEMS Thin Film Materials. The purpose is to specify methods for measuring the Poisson's ratio of MEMS thin film materials.

method.

---Part 22: Electromechanical Tensile Testing Methods for Conductive Thin Films on Flexible Substrates. The purpose is to specify the requirements for conductive thin film materials in MEMS.

Electromechanical property tensile test method.

---Part 26: Description and Test Methods for Microgrooves and Needle Structures. The purpose is to specify the description and test methods for MEMS microgrooves and needle structures.

Description and experimental methods.

---Part 27: Miniature V-T Test (MCT) Method for Measuring Glass Slurry Bond Strength. The purpose is to specify the glass fusion bond strength.

The MCT test method for the bond strength of the structure.

---Part 29: Electromechanical Relaxation Test Methods for Suspended Conductive Thin Films at Room Temperature. The purpose is to specify the electromechanical relaxation test methods for suspended conductive thin films in MEMS devices.

Electromechanical relaxation test method for thin films at room temperature.

---Part 32: Nonlinear Vibration Testing Methods for MEMS Resonators. The purpose is to define the nonlinear vibration characteristics of MEMS resonators.

Performance testing methods.

---Part 35: Test methods for electrical properties of flexible MEMS devices under bending deformation. The purpose is to specify the electrical properties of flexible electromechanical devices...

---Part 36: Environmental and Dielectric Permeability Testing Methods for MEMS Piezoelectric Thin Films. The purpose is to specify the environmental and dielectric withstand voltage testing methods for MEMS piezoelectric thin films.

Environmental and dielectric withstand performance test methods.

---Part 38: Test Method for Adhesion Strength of Metal Powder Paste in MEMS Interconnects. The purpose is to specify the adhesion strength of metal powder paste in MEMS interconnects.

This is a test method for the adhesion strength of powders and pastes.

---Part 40: Threshold Test Methods for MEMS Inertial Shock Switches. The purpose is to specify the threshold values for MEMS inertial shock switches.

Test method.

---Part 44: Testing Methods for Dynamic Characteristics of MEMS Resonant Electric Field Sensing Devices. The purpose is to specify methods for evaluating and determining...

Terminology, definitions, and testing methods for the dynamic performance of MEMS resonant electric field sensitive devices.

Semiconductor devices and microelectromechanical devices Part 12: Resonance Method Using MEMS Structures Bending fatigue test method for thin film materials

1 Scope

This document describes a test method for bending fatigue of thin film materials using the MEMS structural resonance method, employing materials with length and width dimensions both within the range of...

Resonant microstructures with a diameter of 10µm to 1000µm and a thickness of 1µm to 100µm are suitable for lengths and widths less than 1mm and thicknesses of [missing information].

Bending fatigue test of thin film materials ranging from 0.1 µm to 10 µm.

Thin film materials used in the main structures of MEMS often have typical micrometer-scale dimensions, are grown using deposition processes, and are produced through non-lithography methods such as photolithography.

Mechanical processing. MEMS structures typically have higher intrinsic resonant frequencies and intensities than non-MEMS structures, for evaluation and verification.

The lifespan of MEMS structures requires fatigue testing with load cycles up to 101². The test methods specified in this document utilize high...

The resonance of load and high-frequency bending stress is used to evaluate the mechanical fatigue properties of microscale materials in a short time.

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

GB/T 42709.3-2026 Semiconductor devices - Microelectromechanical devices - Part 3: Standard test pieces for tensile testing of thin films (IEC 62047-3:2006, IDT) ISO 12107 Statistical schemes and analytical methods for fatigue test data of metallic materials.

Note. GB/T 24176-2009 Statistical Scheme and Analysis Methods for Fatigue Test Data of Metallic Materials (ISO 12107:2003, IDT)

3 Terms and Definitions

The following terms and definitions apply to this document.

amplitude

Half of the algebraic difference between the maximum and minimum values during a load cycle.

load ratio

The algebraic ratio of the maximum to the minimum load during one cycle.

S-N curve

The stress/strain (S) versus the number of cycles (N) curve.

Static strength or instantaneous failure strength.