GB/T 41765-2022Test method for dislocation density of monocrystalline silicon carbide (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents" drafting.

1 Scope

This document specifies a test method for the dislocation density of silicon carbide single crystals.

This document is applicable to the test of the dislocation density of silicon carbide single crystal whose crystal plane deviates from the {0001} plane and deviates from the < 1120> direction by 0°~8°.

2 Normative references

The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to this document.

GB/T 14264 Terminology of semiconductor materials

GB/T 30656 Silicon carbide single crystal polished wafer

3 Terms and Definitions

The following terms and definitions defined in GB/T 14264 and GB/T 30656 apply to this document.

4 Principles

Revealing dislocations in silicon carbide single crystals using a selective chemical etch technique. Due to the distortion of the lattice around dislocations in SiC single crystals, When the surface of silicon carbide single crystal is etched with potassium hydroxide melt, the corrosion speed is faster at the outcropping of dislocations on the surface of silicon carbide single crystal, so it is easy to It is easy to form corrosion pits with specific shapes composed of some low-index surfaces. Observe the silicon carbide single crystal silicon surface under a microscope and follow certain rules The number of corrosion pits with a specific shape is counted, and the number of corrosion pits per unit field of view is the dislocation density.

5 Interfering factors

5.1 During the corrosion process, the temperature of the potassium hydroxide melt and the corrosion time will affect the corrosion effect of the sample and affect the test results.

5.2 The use time of potassium hydroxide melt during the corrosion process will affect the corrosion effect of the sample. It is recommended that the use time of the melt should not exceed 24h. Replace in time when expired.