GB/T 36360-2018Semiconductor optoelectronic devices—Blank detail specification for middle power light-emitting diodes (English PDF)
半导体光电子器件 中功率发光二极管空白详细规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
June 7, 2018
Implementation date
January 1, 2019
Scope
GB/T 36360-2018 is the English-translated version of 半导体光电子器件 中功率发光二极管空白详细规范.
GB/T 36360-2018 is the blank detail specification for medium power light-emitting diodes, one of the Chinese national forms drawn up for semiconductor optoelectronic devices alongside those for low power and power LEDs.
It prescribes what a detail specification written from it has to state: how the specification itself is identified, through the national standardization body issuing it, the IEC Q number, the version and numbers of the generic and sectional specifications and the country number and release date; and how the device is identified, through its main features and models, its typical structure and packaging materials and a table comparing derivatives.
Environmental and mechanical testing is referred to GB/T 2423, GB/T 2424.19, SJ/T 11394-2009, IEC 60191-2 and IEC 60749-21. It was issued on 7 June 2018 and has applied since 1 January 2019.
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Document preview — GB/T 36360-2018
National Standard of the People's Republic of China
- ICS
- 31.260
- Classification
- L 53
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Foreword
- Introduction
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
Introduction
This blank detail specification is one of a series of blank detailed specifications for semiconductor optoelectronic devices. Related documents.
GB/T 2423.1-2008 Environmental testing of electric and electronic products - Part 2: Test methods Test A. Low temperature
GB/T 2423.3-2016 Environmental testing - Part 2: Test method test Cab.
GB/T 2423.4-2008 Environmental testing of electrical and electronic products - Part 2: Test methods Test Db. alternating heat (12h) 12h cycle)
GB/T 2423.5-1995 Environmental testing for electric and electronic products - Part 2: Test methods Test Ea and guide. Impact
GB/T 2423.10-2008 Environmental testing for electric and electronic products - Part 2: Test method test Fc. Vibration (sinusoidal)
GB/T 2423.15-2008 Environmental testing for electric and electronic products - Part 2: Test methods Tests Ga and guides.
GB/T 2423.22-2012 Environmental testing - Part 2: Test methods Test N. Temperature change
GB/T 2423.23-2013 Environmental testing - Part 2: Test method test Q. Sealing
GB/T 2423.28-2005 Environmental testing for electric and electronic products - Part 2: Test methods Test T. Soldering
GB/T 2423.60-2008 Environmental testing of electric and electronic products - Part 2: Test methods Test U. Terminals and overall Assembly strength
GB/T 2424.19-2005 Environmental testing guidelines for the environmental impact of electrical and electronic products
GB/T 4589.1-2006 Part 10: General specification for discrete devices and integrated circuits
GB/T 12565-1990 Semiconductor device optoelectronic device sub-specification
SJ/T 11394-2009 Semiconductor Light Emitting Diode Test Method
IEC 60191-2-DB-2012 Mechanical standardization of semiconductor devices - Part 2. Dimensions (Mechanical Standardizationofsemiconductordevices-Part 2: Dimensions)
IEC 60749-21:2011 Methods of mechanical and climatic testing of semiconductor devices - Part 21. Solderability (Semiconductorde-vices-Mechanicalandclimatictestsmethods-Part 21: Solderability)
Request information The items required below shall be included in the corresponding blanks of the regulations. Identification of detailed specifications.
[1] The name of the national standardization body authorized to issue detailed specifications. [2] IEC Q detailed specification number.
[3] Version number and standard number of the general and sub-specifications.
[4] Detailed specification of the country number, release date and any more detailed information required by the national standard system. Device identification. [5] Main features and models.
[6] Typical structures (materials, major processes) and packaged materials. If a device has several derivatives, those different points should It is pointed out that, for example, the difference in characteristics is listed in the comparison table.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
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