GB/T 36359-2018Semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes (English PDF)
半导体光电子器件 小功率发光二极管空白详细规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
June 7, 2018
Implementation date
January 1, 2019
Scope
GB/T 36359-2018 is the English-translated version of 半导体光电子器件 小功率发光二极管空白详细规范.
Low power light-emitting diodes are the subject of GB/T 36359-2018, the Chinese national blank detail specification on which their detail specifications are modelled.
The document is a form to be completed: it lists the request information that has to appear in the blanks, from the identification of the detail specification, with the issuing national standardization authority, the IEC Q number, the revision and numbers of the generic and sectional specifications, the country number and the release date, to the device identification, with functions and type designations, typical structure, materials, main processes and package, and a comparison table for derivative products.
Related documents include GB/T 4589.1-2006, GB/T 12565-1990, SJ/T 11394-2009 and the GB/T 2423 environmental test series. It was issued on 7 June 2018 and has applied since 1 January 2019.
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Document preview — GB/T 36359-2018
National Standard of the People's Republic of China
- ICS
- 31.260
- Classification
- L 53
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Foreword
- Introduction
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
Introduction
This blank detail specification is one of a series of blank detail specifications for semiconductor optoelectronic devices. Related documents.
GB/T 2423.1-2008 Environmental testing for electric and electronic products Part 2: Test methods Test A. Low temperature
GB/T 2423.3-2016 Environmental testing - Part 2: Test method test Cab. Constant damp heat test
GB/T 2423.4-2008 Environmental testing for electric and electronic products Part 2: Test methods Test Db. Alternating heat (12h 12h loop)
GB/T 2423.5-1995 Environmental testing for electric and electronic products Part 2: Test methods Test Ea and Guidelines. Impact
GB/T 2423.10-2008 Environmental testing for electric and electronic products Part 2: Test methods Test Fc. Vibration (sine)
GB/T 2423.15-2008 Environmental testing for electric and electronic products Part 2: Test methods Tests Ga and Guidelines. Steady state addition speed
GB/T 2423.22-2012 Environmental tests Part 2: Test methods Test N. Temperature changes
GB/T 2423.23-2013 Environmental test Part 2: Test method Test Q. Seal
GB/T 2423.28-2005 Environmental testing for electric and electronic products Part 2: Test methods Test T. Soldering
GB/T 2423.60-2008 Environmental testing for electric and electronic products Part 2: Test methods Test U. Terminals and overall safety Fitting strength
GB/T 2424.19-2005 Environmental test for simulation of impact of environmental testing on electric and electronic products
GB/T 4589.1-2006 Semiconductor Devices Part 10: General Specification for Discrete Devices and Integrated Circuits
GB/T 12565-1990 Semiconductor device optoelectronic device sectional specification
SJ/T 11394-2009 Semiconductor light-emitting diode test method Mechanical standardization of IEC 60191-2-DB-2012 semiconductor devices - Part 2: Dimensional specification (Mechanical standardization ofsemiconductorordevices-Part 2: Dimensions)
IEC 60749-21:2011 Semiconductor device mechanical and climatic test methods. Part 21. Solderability (Semiconductor de-vices-Mechanicalandclimatictestsmethods-Part 21: Solderability)
Request information The contents of the following requirements shall be included in the corresponding blanks of the provisions. Detailed specification identification.
[1] Name of national standardization authority authorized to issue detailed specifications. [2] IEC Q detail specification number.
[3] Revision number and standard number of general specifications and sub-standards.
[4] Detailed specification of the country number, release date, and any more detailed information required by the national standards system. Device identification. [5] Main functions and models.
[6] Information on typical structures (materials, major processes) and packages. If a device has several derivative products, those differences should be It is pointed out that, for example, differences in characteristics are listed in the comparison table.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
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