GB/T 35010.1-2018Semiconductor die products -- Part 1: Requirements for procurement and use (English PDF)

1 Scope

This part of GB/T 35010 is used to guide the production, supply and use of semiconductor chip products. Semiconductor chip products include.

- Wafers;

- Single bare chip;

- Chips and wafers with interconnect structures;

- Small or partially packaged chips and wafers.

This section defines the minimum requirements for the data required for this type of chip product and also contributes to the design and procurement of chip-containing component products. It contains

The requirements for data are covered as follows.

- product identification;

- Product data;

- Chip mechanical information;

- Test, quality, assembly and reliability information;

- Process, transport, and store information.

This section includes specific data used to describe the geometric, physical, and connection method data of the chip during R&D and manufacturing.

Claim. Refer to Appendix A and Appendix B for related vocabularies and abbreviations.

2 Normative references

The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article

Pieces. For undated references, the latest version (including all amendments) applies to this document.

GB/T 25915.1-2010 Cleanrooms and related controlled environments - Part 1. Air cleanliness level (ISO 14644-1.1999,

IDT)

IEC 60050 (all parts) Electrotechnical terminology (International electrotechnicalvocabulary)

IEC 60191 (all parts) Mechanical standardization of semiconductor devices (Mechanicalstandardizationofsemiconductor

Devices)

IEC 60191-4.1999 Mechanical standardization of semiconductor devices - Part 4. Semiconductor device package outline coding and classification (Mechanicalstandardizationofsemiconductordevices-Part 4.Codingsystemandclassificationinto

Formsofpackageoutlinesforsemiconductordevicepackages)

Amendment1(2001) Amenduent2(2002)

IEC 61360-1 Standard data element types and related classification schemes for electrical components - Part 1. Definitions - Principles and methods (Standarddataelementtypeswithassociatedclassificationschemeforelectriccomponents-Part 1.

Definitions-Principlesandmethods)

IEC 62258-2 Semiconductor chip products Part 2. Data interchange formats (Semiconductor die products-Part 2.

Exchangedataformats)

IEC /T R62258-3 Semiconductor Chip Product Part 3. Guidelines for Handling, Packaging and Storage (Semiconductor dieprod- ucts-Part 3.Recommenduatinsforgoodpracticeinhandling,packingandstorage)

GB/T 46280.2 | GB/T 15651.7 | GB/T 43770 | GB/T 35010.5 | GB/T 35010.4 | GB/T 35010.3 | […]