GB/T 43931-2024General specification for microwave integrated circuit chip for aerospace (English PDF)
宇航用微波集成电路芯片通用规范
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
June 29, 2024
Implementation date
October 1, 2024
Scope
GB/T 43931-2024 is the English-translated version of 宇航用微波集成电路芯片通用规范.
GB/T 43931-2024 is the Chinese national standard covering general specification for microwave integrated circuit chip for aerospace. Issued on 29 June 2024, it has been in force since 1 October 2024.
Document preview — GB/T 43931-2024
National Standard of the People's Republic of China
- ICS
- 31.200
- Classification
- L 55
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- PrefaceIII
- 1 Scope1
- 2 Normative references1
- 3 Terms, definitions and abbreviations1
- 3.1 Terms and Definitions1
- 3.2 Abbreviations1
- 4 Technical Requirements2
- 4.1 General requirements2
- 4.2 Chip Classification2
- 4.3 Design, structure, materials and technology2
- 4.4 Production process control5
- 4.5 Electrical properties5
- 4.6 Logo5
- 4.7 Quality Assurance Requirements5
- 4.8 ESDS6
- 4.9 Radiation resistance level6
- 4.10 Evaluation of Chip Hydrogen Tolerance7
- 4.11 Wafer Quality Control7
- 4.12 Traceability requirements9
- 5 Quality Assurance Regulations9
- 5.1 Inspection categories9
- 5.2 Destructive and non-destructive tests9
- 5.3 Environmental conditions for testing and inspection9
- 5.4 Batch composition9
- 5.5 Resubmission of unqualified batches10
- 5.6 Samples for identification and quality consistency testing10
- 5.7 Unqualified10
- 5.8 Contractor screening10
- 5.9 Failure11
- 5.10 Identification and testing11
- 5.11 Quality consistency inspection12
- 5.12 Inspection Records14
- 5.13 User acceptance14
- 6 Delivery Preparation1616
- 6.1 Packaging requirements16
- 6.2 Storage requirements17
- 6.3 Transport requirements17
- 6.4 Documents to be provided upon delivery17
- 7 Explanation17
- 7.1 Intended use17
- 7.2 Contents of ordering documents17
- 7.3 Chip Usage Instructions18
- Appendix A (Normative) Wafer Batch Acceptance Requirements19
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed and coordinated by the National Technical Committee for Standardization of Aerospace Technology and Its Applications (SAC/TC425).
This document was drafted by: China Electronics Technology Group Corporation No. 13 Research Institute, Xi'an Space Radio Technology Research Institute, China Electronics Science and Technology Group Corporation The 55th Institute of Technology Group Corporation, Shanghai Precision Metrology and Testing Institute, and Guangzhou Tianji Electronic Technology Co., Ltd.
The main drafters of this document are: Lin Liyan, Fan Hailing, Wang Guoquan, Han Dong, Cui Bo, He Ting, Chen Zhe, Song Xiang, and Yang Junfeng.
General specification for microwave integrated circuit chips for aerospace use
1 Scope
This document specifies the technical requirements, quality assurance regulations and delivery preparation for microwave integrated circuit chips for aerospace use.
This document applies to the design, production and product quality assurance of aerospace microwave integrated circuit chips (hereinafter referred to as "chips").
2 Normative references
GB/T 2828.1-2012
GB/T 2900
GB/T 4937.17-2018
GB/T 4937.18-2018
GB/T 4937.19-2018
GB/T 4937.22-2018
GB/T 4937.23-2023
GB/T 4937.26-2023
GB/T 19403.1-2003
GB/T 35010.1-2018
IEC 60749
IEC 60749
IEC 60749
3 Terms, definitions and abbreviations
3.1 Terms and Definitions
The terms and definitions defined in GB/T 2900 (all parts) and GB/T 35010.1-2018 apply to this document.
3.2 Abbreviations
The following abbreviations apply to this document. DRC. Design Rule Check
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.
Referenced standards
Normative references
GB/T 2900 · GB/T 4937.17-2018 · GB/T 4937.18-2018 · GB/T 4937.19-2018 · GB/T 4937.22-2018 · GB/T 4937.23-2023 · GB/T 4937.26-2023 · GB/T 19403.1-2003 · GB/T 35010.1-2018 · IEC 60749
Editions of GB/T 43931
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 43931-2024 | General specification for microwave integrated circuit chip for aerospace | current edition | Current |
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Related Standards
GB/T 2828.1-2012 — Sampling procedures for inspection by attributes - Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection
GB/T 2900.1-2008 — Electrotechnical terminology - Fundamental terms
GB/T 2900.12-2008 — Electrotechnical terminology - surge arresters,low-voltage surge protective devices and components
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