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GB/T 43931-2024General specification for microwave integrated circuit chip for aerospace (English PDF)

宇航用微波集成电路芯片通用规范

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

June 29, 2024

Implementation date

October 1, 2024

Scope

GB/T 43931-2024 is the English-translated version of 宇航用微波集成电路芯片通用规范.

GB/T 43931-2024 is the Chinese national standard covering general specification for microwave integrated circuit chip for aerospace. Issued on 29 June 2024, it has been in force since 1 October 2024.

Document preview — GB/T 43931-2024

National Standard of the People's Republic of China

ICS
31.200
Classification
L 55

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • PrefaceIII
  • 1 Scope1
  • 2 Normative references1
  • 3 Terms, definitions and abbreviations1
  • 3.1 Terms and Definitions1
  • 3.2 Abbreviations1
  • 4 Technical Requirements2
  • 4.1 General requirements2
  • 4.2 Chip Classification2
  • 4.3 Design, structure, materials and technology2
  • 4.4 Production process control5
  • 4.5 Electrical properties5
  • 4.6 Logo5
  • 4.7 Quality Assurance Requirements5
  • 4.8 ESDS6
  • 4.9 Radiation resistance level6
  • 4.10 Evaluation of Chip Hydrogen Tolerance7
  • 4.11 Wafer Quality Control7
  • 4.12 Traceability requirements9
  • 5 Quality Assurance Regulations9
  • 5.1 Inspection categories9
  • 5.2 Destructive and non-destructive tests9
  • 5.3 Environmental conditions for testing and inspection9
  • 5.4 Batch composition9
  • 5.5 Resubmission of unqualified batches10
  • 5.6 Samples for identification and quality consistency testing10
  • 5.7 Unqualified10
  • 5.8 Contractor screening10
  • 5.9 Failure11
  • 5.10 Identification and testing11
  • 5.11 Quality consistency inspection12
  • 5.12 Inspection Records14
  • 5.13 User acceptance14
  • 6 Delivery Preparation1616
  • 6.1 Packaging requirements16
  • 6.2 Storage requirements17
  • 6.3 Transport requirements17
  • 6.4 Documents to be provided upon delivery17
  • 7 Explanation17
  • 7.1 Intended use17
  • 7.2 Contents of ordering documents17
  • 7.3 Chip Usage Instructions18
  • Appendix A (Normative) Wafer Batch Acceptance Requirements19

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed and coordinated by the National Technical Committee for Standardization of Aerospace Technology and Its Applications (SAC/TC425).

This document was drafted by: China Electronics Technology Group Corporation No. 13 Research Institute, Xi'an Space Radio Technology Research Institute, China Electronics Science and Technology Group Corporation The 55th Institute of Technology Group Corporation, Shanghai Precision Metrology and Testing Institute, and Guangzhou Tianji Electronic Technology Co., Ltd.

The main drafters of this document are: Lin Liyan, Fan Hailing, Wang Guoquan, Han Dong, Cui Bo, He Ting, Chen Zhe, Song Xiang, and Yang Junfeng.

General specification for microwave integrated circuit chips for aerospace use

1 Scope

This document specifies the technical requirements, quality assurance regulations and delivery preparation for microwave integrated circuit chips for aerospace use.

This document applies to the design, production and product quality assurance of aerospace microwave integrated circuit chips (hereinafter referred to as "chips").

2 Normative references

GB/T 2828.1-2012

GB/T 2900

GB/T 4937.17-2018

GB/T 4937.18-2018

GB/T 4937.19-2018

GB/T 4937.22-2018

GB/T 4937.23-2023

GB/T 4937.26-2023

GB/T 19403.1-2003

GB/T 35010.1-2018

IEC 60749

IEC 60749

IEC 60749

3 Terms, definitions and abbreviations

3.1 Terms and Definitions

The terms and definitions defined in GB/T 2900 (all parts) and GB/T 35010.1-2018 apply to this document.

3.2 Abbreviations

The following abbreviations apply to this document. DRC. Design Rule Check

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 2900 · GB/T 4937.17-2018 · GB/T 4937.18-2018 · GB/T 4937.19-2018 · GB/T 4937.22-2018 · GB/T 4937.23-2023 · GB/T 4937.26-2023 · GB/T 19403.1-2003 · GB/T 35010.1-2018 · IEC 60749

Editions of GB/T 43931

EditionTitleRevisionStatus
GB/T 43931-2024General specification for microwave integrated circuit chip for aerospacecurrent editionCurrent

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