GB/T 34177-2017Quartz glass wafer for lithography (English PDF)
光刻用石英玻璃晶圆
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
September 7, 2017
Implementation date
August 1, 2018
Scope
GB/T 34177-2017 is the English-translated version of 光刻用石英玻璃晶圆.
GB/T 34177-2017 is the Chinese standard "Quartz glass wafer for lithography". Its scope clause reads: This standard specifies the lithography quartz glass wafer (hereinafter referred to as quartz glass wafer) terms and definitions, classification, requirements, test methods, Inspection rules and signs, packaging, transportation and storage.
This standard applies to semiconductor integrated circuits, optical communications, micro-electromechanical systems (MEMS), optoelectronic devices and light-emitting diode (LED) light Engraved in the process used as a substrate of quartz glass wafer. Its clauses include terms and definitions.
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Document preview — GB/T 34177-2017
National Standard of the People's Republic of China
- ICS
- 81.040.30
- Classification
- Q 35
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- 3.1 Total thickness change totalthicknessvariation; TTV
- 3.2 Flatness
- 3.3 Curvature bow
- 3.4 Warp
1 Scope
This standard specifies the lithography quartz glass wafer (hereinafter referred to as quartz glass wafer) terms and definitions, classification, requirements, test methods,
Inspection rules and signs, packaging, transportation and storage.
This standard applies to semiconductor integrated circuits, optical communications, micro-electromechanical systems (MEMS), optoelectronic devices and light-emitting diode (LED) light
Engraved in the process used as a substrate of quartz glass wafer.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
Methods of chemical composition analysis of quartz glass GB/T 3284-2015
GB/T 5949 transparent quartz glass bubble, gas line test methods
Surface roughness of gallium nitride single crystal substrate by atomic force microscopy
JC/T 185 optical quartz glass
Internal stress testing methods for JC/T 655 quartz glass products
JC/T 2205 quartz glass terms
3 Terms and definitions
JC/T 2205 and defined by the following terms and definitions apply to this document.
3.1 Total thickness change totalthicknessvariation; TTV
The difference between the maximum and minimum thickness of quartz glass wafers.
3.2 Flatness
For example, a surface of a quartz glass wafer is sucked by a vacuum chuck in an ideal,
On a flat suction cup, the deviation of the other surface from the specified reference surface is indicated by the total readings in the measurement range (TIR).
3.3 Curvature bow
Deviation from the center plane of the median plane of the free, non-gripped quartz glass wafer to the plane of the median plane.
The median plane reference plane is a plane defined by three equidistant points on a given circumference that is less than the nominal diameter of the quartz glass wafer.
3.4 Warp
The difference between the maximum and minimum distance of the free, uncladished quartz glass wafer median plane relative to the reference plane.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
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