GB/T 33772.3-2025Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (English PDF)

Foreword

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is Part 3 of GB/T 33772 "Quality Assessment Systems". GB/T 33772 has already published the following parts.

---Part 1: Statistics and Analysis of Defects on Printed Circuit Board Assemblies;

---Part 2: Selection and Use of Sampling Plans for the Inspection of Electronic Components and Packages;

---Part 3: Selection and use of sampling schemes for final product inspection and process monitoring of printed circuit boards and laminates.

This document is modified to adopt IEC 61193-3:2013 "Quality assessment systems – Part 3: Inspection and testing of final products of printed circuit boards and laminates".

"Procedure for supervising the selection and use of sampling plans." Compared with IEC 61193-3:2013, this document has undergone the following structural adjustments.

---Added abbreviations for Chapter 4;

---Chapter 5 corresponds to Chapter 4 of IEC 61193-3:2013, and Chapter 6 corresponds to Chapters 4 and 5 of IEC 61193-3:2013.

Chapters 6 and 7 correspond to Chapters 7, 8, and 9 of IEC 61193-3:2013, and Chapter 8 corresponds to IEC 61193-Chapter 10 in 2013.

The technical differences between this document and IEC 61193-3:2013, and the reasons therefor, are as follows.

---IEC 60194:2006 has been replaced by the normatively referenced GB/T 2036 (see Chapter 3), and GB/T 4588.4 has been replaced by the normatively referenced GB/T 4588.4.

IEC 62326-4:1996 (see 6.2, 7.1.1) has been replaced, and ISO 9000:2005 (see section 7.1.1) has been replaced with normative reference GB/T 19000.

(Chapter 3) to adapt to my country's technological conditions and increase operability;

---Table 6 in section 10.4, Process Testing and Control, of IEC 61193-3:2013 has been deleted to align with GB/T 4588.4;

---Due to adjustments made to the main text, and to maintain consistency, some terms and definitions from IEC 61193-3:2013 have been removed.

(See Chapter 3 of IEC 61193-3:2013);

---ISO 14560:2004, which is normatively referenced in IEC 61193-3:2013, has been removed because ISO 14560:2004 is obsolete.

The following editorial changes have been made to this document.

---The fields "Test Number" and "Process Control Code" have been removed from Table A.1 of Appendix A (Informative) of IEC 61193-3:2013;

---Note 3.3 in IEC 61193-3:2013 has been deleted;

---The "Characteristics" in Table A.1 have been adjusted to be consistent with GB/T 4588.4.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed and is under the jurisdiction of the National Technical Committee on Standardization of Printed Circuits (SAC/TC47).

Introduction

GB/T 33772 "Quality Assessment System" is proposed to consist of three parts.

---Part 1: Statistics and Analysis of Defects on Printed Circuit Board Assemblies. The purpose is to specify various processing methods for soldered printed circuit board assemblies.

The statistical and analytical methods for defects also specify two methods for collecting defect parts per million (ppm) data (1ppm = 1 × 10-6).

---Part 2: Selection and Use of Sampling Plans for the Inspection of Electronic Components and Packages. The purpose is to provide sampling plans for the inspection of electronic components and packages.

The inspection of assemblies provides sampling systems and protocols applicable to products manufactured under effective process control to prevent non-conforming products.

Outflow.

---Part 3: Selection and Use of Sampling Plans for Final Product Inspection and Process Monitoring of Printed Circuit Boards and Laminates. The purpose is to regulate...

The selection and use of sampling plans for attribute testing in the final product inspection and process monitoring of printed circuit boards and laminates, including sampling.

Applications of methods, attribute classification, testing plans, and sampling plans, etc.

This document clearly describes the basic sampling criteria that meet customer requirements, and outlines the sampling methods, attribute classification, inspection plans, and sampling procedures.

The application of the case was stipulated.

The sampling plan selected and used for final product inspection and process supervision of printed circuit boards and laminates must clearly define the sampling criteria and sampling plan.

Ideally, different sampling strategies should be developed based on the key impact of each specific characteristic.

Batch counting methods are divided into continuous sampling and production batch sampling. Production batch sampling is further divided into production batch counting sampling and production batch counting sampling.

In quantity sampling, any sampling plan can generate an operational characteristic curve, representing the percentage of nonconforming or defective batches at different levels.

risk.

Product attributes are part of the sampling process; based on importance or severity, individual attributes related to a specified requirement are selected.

Product attributes are categorized into critical attributes, important attributes, and minor attributes. Sampling plans are based on the quality conformity inspection level and the attributes (critical, important, minor, etc.).

Choose from primary and secondary characteristics and defect features (critical, primary, secondary).

As the industry develops, customers require process control methods to monitor the production process from the outset. This includes evaluating product delivery, Sampling criteria should be clearly defined and continuously improved in process control, as follows.

a) Sampling statistics A specified number of samples are drawn from a given batch for statistical analysis, and the probability of anomalies is assessed using the statistical data.

b) Zero Defect Standard Zero defects in production batches can be achieved by defining and revising product acceptance standards.

c) Economic efficiency Establish higher levels of nonconforming product characteristics to reduce quality costs incurred when nonconforming products are discovered or accidentally delivered to customers.

Establish acceptable quality standards to reduce the occurrence of similar situations.

d) Statistical Process Control (SPC) A process control procedure is established based on rejection criteria. Then, the process is improved through control experiments, and statistical analysis is used to determine the process.

Improvements have been made and the occurrence of rejections has been reduced.

Quality Assessment System Part 3: Printed Circuit Boards and for final product inspection and process supervision of laminates Selection and use of sampling plans

1 Scope

This document specifies the selection and use of sampling schemes for attribute testing in the final product inspection and process monitoring of printed circuit boards and laminates, including...

This includes sampling methods, attribute classification, inspection plans, and the application of sampling plans.

This document applies to the final product inspection and process monitoring of printed circuit boards and laminates.

2 Normative references

The contents of the following documents, through normative references within the text, constitute essential provisions of this document. Dated citations are not included.

For references to documents, only the version corresponding to that date applies to this document; for undated references, the latest version (including all amendments) applies.

This document.

GB/T 2036 Printed Circuit Terminology (GB/T 2036-1994, IEC 60194:1988, NEQ) GB/T 4588.4 Specifications for Rigid Multilayer Printed Circuit Boards GB/T 19000 Quality Management Systems – Fundamentals and Vocabulary (GB/T 19000-2016, ISO 9000:2015, IDT)

3 Terms and Definitions

The terms and definitions defined in GB/T 2036 and GB/T 19000, as well as the following terms and definitions, apply to this document.

attribute

The actual requirements and permissible deviations of a specific product unit.

Note. The actual requirements are as follows.

a) It is specified that there are requirements for allowing positive and negative deviations;

b) Requirements specifying whether absolute positive or absolute negative deviations are permissible;

c) Requirements that are not allowed to deviate.

critical attribute

A defect may expose individuals who use, maintain, or rely on the product to a hazardous or unsafe environment, or a defect may cause harm to the end product.

The loss of the main function or performance of a product (such as a ship, an aircraft, a computer, a medical device, a communication satellite, etc.).

Major attribute

Defects may cause product failure or reduce the attributes of a product unit for its intended use.

minor attribute

The defect has little impact on the product's intended use, or the defect deviates from the established standards, but affects the effective use and operation of the product unit.

The attribute is not very loud.