GB/T 31469-2015Semiconductor materials cutting fluid (English PDF)

1 Scope

This standard specifies the technical requirements, test methods, inspection rules semiconductor material cutting fluid, logo, packaging, storage and transportation

Claim.

This standard applies to semiconductor materials cutting wire cutting fluid used.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein

Member. For undated references, the latest edition (including any amendments) applies to this document.

Preparation of GB/T 601 chemical reagent standard titration solution

GB/T 603 chemical reagent in test methods - Preparations with

GB/T 3143 Determination of color liquid chemicals (Hazen unit --- platinum - cobalt color number)

Determination of GB/T 4472-2011 Chemical density, relative density

Determination of GB/T 6368 aqueous surfactant solution of pH potentiometric method

GB/T 6678 General Principles for Sampling Chemical Products

GB/T 6680 General rules for sampling liquid chemical products

Laboratory use specifications and test methods GB/T 6682-2008 Analysis

GB/T 8170 repair value expressed about the rules and limit values and judgment

GB/T 10247 Viscosity Measurement

Determination of GB/T 11275 surfactant water content

GB/T 11446.1 Electronic grade water

GB/T 12582 Determination of the electrical conductivity of liquid hydrocarbons

GB/T 15346-2012 Chemicals Packaging and marking

3 Technical requirements

Semiconductor Materials cutting fluid should meet the technical requirements specified in Table 1.

Table 1 semiconductor and solar-grade crystal materials cutting wire cutting fluid requirements project

Claim

Type of Type I II III

Appearance colorless or yellowish transparent liquid

Viscosity mPa · s (25 °C)

<=40 40 ~ 52 >=52 density g/cm3 (25 °C) […]