GB/T 15879.4-2019Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (English PDF)

Foreword

GB/T 15879 "Mechanical Standardization of Semiconductor Devices" has been or is planned to be released as follows.

--- Part 1. General rules for drawing outlines of discrete device packages;

--- Part 2. Size;

--- Part 3. General rules for drawing outline drawings of integrated circuits;

--- Part 4. Classification and coding system for the outline of semiconductor device packages;

---Part 5. Recommended values for automated tape carrier integrated soldering (TAB);

--- Part 6. General rules for drawing outlines of surface mount semiconductor device packages.

This part is the fourth part of GB/T 15879.

This part is drafted in accordance with the rules given in GB/T 1.1-2009.

This section uses the translation method equivalent to IEC 60191-4.2013 "Mechanical standardization of semiconductor devices Part 4. Semiconductor devices

Classification and coding system for package shapes.

1 Scope

This part of GB/T 15879 specifies the classification and naming methods for the package shape of semiconductor devices, as well as packaging for semiconductor devices.

A systematic approach to general descriptive naming.

This descriptive naming method provides a useful communication tool, but does not ensure that the same encoded package is interchangeable.

2 coding system for semiconductor device package outline

The coding scheme for the following semiconductor device package outlines is applicable to the relevant mechanical drawings and documents.

a) Part 1. A three-digit serial number (000~999) indicating the numbering sequence;

b) Part II. a single letter representing the outline drawing (see Chapter 3);

c) Part III. Represents a two-digit serial number derived from the outline drawing (00~99).

The prefix P represents a temporary figure number.

Example.

---101A00;

---050G13;

---P101F01.

3 Classification of semiconductor device package outlines

The classification rules for the outline of semiconductor device packages are as follows.

a) Form A. single-ended lead;

b) Form B. heat sink installation;

c) Form C. bolt mounting;

d) Form D. axial lead;

e) Form E. surface mounting;

f) Form F. single-ended heat sink installation;

g) Form G. double column and four columns;

h) Form H. No lead in the axial direction.

4 coding system for semiconductor device package