GB/T 15879-1995Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits (English PDF)
半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
GB/T 15879 | Evolution and historical versions
| Std ID | Title | Status |
|---|---|---|
| GB/T 15879.5-2018 | Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits | Valid |
| GB/T 15879-1995 | Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits | Obsolete |
GB/T 15879-1995 is obsolete. It has been replaced by GB/T 15879.5-2018. This page sells the obsolete edition, for projects and contracts that still cite it.
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Issued by
China State Bureau of Technical Supervision
Level / Type
National · Recommended
Issue date
January 2, 1995
Implementation date
August 1, 1996
Scope
GB/T 15879-1995 is the English-translated version of 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值.
GB/T 15879-1995 is the Chinese national standard "Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits".
It was issued on January 2, 1995 by the China State Bureau of Technical Supervision, and took effect on August 1, 1996. It is obsolete: it has been replaced by GB/T 15879.5-2018.
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Document preview — GB/T 15879-1995
National Standard of the People's Republic of China
Issued by: China State Bureau of Technical Supervision
Contents
- Document data
1 Document data
Sector: National standard (Recommended).
Issuing body: China State Bureau of Technical Supervision.
Date of issue: 1995-01-02.
Date of implementation: 1996-08-01.
Status: obsolete, replaced by GB/T 15879.5-2018.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — all pages — is available in the English PDF.
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Related Standards
GB/T 15879.4-2019 — Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
GB/T 15879.5-2018 — Mechanical standardization of semiconductor devices -- Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits
GB/T 15879.603-2026 — Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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