GB/T 15022-1994Resin based reactive compounds used for electrical insulation -- Part 1: Definitions and general requirements (English PDF)

Foreword

GB/T 15022 "for electrical insulation resin based reactive compounds" consists of the following components.

--- Part 1. Definitions and general requirements;

--- Part 2. Test methods;

--- Part 3. unfilled epoxy compound;

--- Part 4. Unsaturated polyester impregnating resin;

--- Part 5. quartz filler epoxy compound;

This section GB/T 15022 Part 1.

This section identical with IEC 60455-1:1998 "electrically insulating resin based reactive compounds - Part 1. Definitions and general requirements" (In English).

This part of IEC 60455-1:1998 compared to do the following editorial changes.

a) Remove the IEC 60455-1:1998 Foreword, Introduction and Appendix A "References" listed "Reference" and in the IEC 61006 included in Chapter 2, "Normative references" in;

b) Where dated references did not note when referencing provisions in date, all make up date.

This Part replaces GB/T 15022-1994 "electrical insulation solventless polymeric resin composite Definitions and general requirements." this portion of the GB/T 15022-1994 phase comparator major changes are as follows.

a) The title reg different names;

b) expansion of the provision "Definitions" in Chapter 4;

c) increase the "Categories" chapter.

This part is proposed by the China Electrical Equipment Industrial Association.

This part of the National Standardization Technical Committee of the insulating material (SAC/TC51) centralized.

This part mainly drafted by. Guilin Institute of Electrical Science.

Drafters of this section. Malin Quan.

This part of the standard replaces the previous editions are.

--- GB/T 15022-1994.

GB/T 15022.1-2009/IEC 60455-1:1998 Electrical insulation resin based reactive compounds Part 1. Definitions and general requirements

1 Scope

GB/T 15022 specifies the name of this part of the electrically insulating resin based reactive compounds and their components, definitions, classifications and generally begging. All of the active compound is a solvent-free, but may contain reactive diluents and fillers. Curing reaction is a polymerization reaction or crosslinking reaction. This section does not include the coating powder used as an active compound.

This section applies to electrical insulation use resin based reactive compounds and its components, their usual range in Table 1.

Table 1 complex common range

Application of symbolic code Cast composite CC

--- Embedding compound EBC

--- Perfusion complex PC Encapsulating complex ECC Impregnated composite IC

--- For immersion ICD

--- For Trickle ICT

--- For vacuum pressure impregnation VPI it said about the symbolic code can be used as product categories for short. According to actual needs, you can supplement more relevant symbolic code.

2 Normative references

The following documents contain provisions which, through reference GB/T 15022 in this section constitute provisions of this section. For dated reference documents Member, all subsequent amendments (not including errata content) or revisions do not apply to this section, however, encouraged to reach under this section Parties to research agreement to use the latest versions of these documents. For undated reference documents, the latest versions apply to this section.

GB/T 1844.1-2008 Plastics - Symbols and abbreviated terms - Part 1. Basic polymers and their special characteristics (ISO 1043-1.

2001, IDT)

GB/T 1844.2-2008 Plastics - Symbols and abbreviations - Part 2. Fillers and reinforcing materials (ISO 1043-2:2000, IDT) GB/T 2035-2008 Plastics terms and their definitions (ISO 472:1999, IDT) GB/T 2900.5-2002 Electrotechnical terminology insulating solids, liquids and gases (eqvIEC 60050 (212).1990) GB/T 15022.2-2007 electrically insulating resin based reactive compounds - Part 2. Test methods (IEC 60455-2:1998, MOD) ISO 4597-1. 1983 plastic epoxy curing agents and catalysts - Part 1. Designation the glass transition temperature of the test method for measuring electrical insulating materials 2004. IEC 61006

3 Named

It can be cured at ambient or elevated temperatures depending on the composition and activity of the complex. It can be generated by curing reaction of a rigid, resilient or flexible cured Thereof. According to a particular compound is contained in the resin composition itself or the main part of the named active. The resin used in Table 2. Resin and about GB/T 15022.1-2009/IEC 60455-1:1998