SJ/T 2709-2016Methods of measurement for temperature of printed board assemblies (English PDF)
印制板组装件温度测试方法
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
October 22, 2016
Implementation date
January 1, 2017
Scope
SJ/T 2709-2016 is the English-translated version of 印制板组装件温度测试方法.
SJ/T 2709-2016 — This standard specifies the test equipment, test conditions, test procedures and test data processing for the temperature test of printed board assemblies.
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Document preview — SJ/T 2709-2016
National Standard of the People's Republic of China
- Classification
- L 30
- Replacing
- SJ 2709-1986
Issued by: Ministry of Industry and Information Technology
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the test equipment, test conditions, test procedures and test data processing for the temperature test of printed board assemblies. This standard is applicable to testing the ambient temperature, temperature field, and component surface temperature of printed board assemblies.
Document data
Chinese classification (CCS): L30.
Estimated length of the Chinese original: 7,746 words.
Supersedes the earlier edition SJ 2709-1986.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 5 pages — is available in the English PDF.
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