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SJ/T 11789-2021Evaluation method of lead-free nozzle (English PDF)

无铅焊点可靠性评价方法

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Issued by

Ministry of Industry and Information Technology

Level / Type

National · Recommended

Issue date

August 21, 2021

Implementation date

November 1, 2021

Scope

SJ/T 11789-2021 is the English-translated version of 无铅焊点可靠性评价方法.

SJ/T 11789-2021 — Evaluation method of lead-free nozzle

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Document preview — SJ/T 11789-2021

National Standard of the People's Republic of China

Issued by: Ministry of Industry and Information Technology

What this standard covers1
Document data2

What this standard covers

This standard specifies the acceptance requirements, reliability evaluation technical requirements, procedures and test methods for lead-free solder joints. This standard applies to the acceptance and reliability evaluation of lead-free solder joints.

Document data

Estimated length of the Chinese original: 74,726 words.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 49 pages — is available in the English PDF.

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