SJ/T 11775-2021Technical specification of raw materials saving and pollutants discharge reduction in particleboard production (English PDF)
半导体材料多线切割机
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
March 5, 2021
Implementation date
June 1, 2021
Scope
SJ/T 11775-2021 is the English-translated version of 半导体材料多线切割机.
SJ/T 11775-2021 — Technical specification of raw materials saving and pollutants discharge reduction in particleboard production
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Document preview — SJ/T 11775-2021
National Standard of the People's Republic of China
- Classification
- B 70
Issued by: Ministry of Industry and Information Technology
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the terms and definitions, product classification and specifications, requirements, inspection methods, inspection rules, marking, packaging, transportation and storage of multi-wire cutting machines for semiconductor materials. This standard applies to multi-wire cutting machines for cutting monocrystalline silicon, polycrystalline silicon, germanium and sapphire and other hard and brittle semiconductor materials.
Document data
Chinese classification (CCS): B70.
Estimated length of the Chinese original: 8,831 words.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 6 pages — is available in the English PDF.
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