SJ/T 11725-2018Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board (English PDF)
印制电路用导热型覆铜箔环氧复合基层压板
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
April 30, 2018
Implementation date
July 1, 2018
Scope
SJ/T 11725-2018 is the English-translated version of 印制电路用导热型覆铜箔环氧复合基层压板.
SJ/T 11725-2018 — Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board
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Document preview — SJ/T 11725-2018
National Standard of the People's Republic of China
- ICS
- 31.180
- Classification
- L 30
Issued by: Ministry of Industry and Information Technology
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, storage and transportation of heat-conducting copper-clad epoxy composite laminates for printed circuits (hereinafter referred to as thermally conductive composite copper-clad laminates).
Document data
International classification (ICS): 31.180.
Chinese classification (CCS): L30.
Estimated length of the Chinese original: 16,159 words.
Standards quoted by this document
GB/T 2036; GB/T 4722-2017; GB/T 5230; GB/T 36476-2018; SJ/T 11283; SJ/T 11282
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 11 pages — is available in the English PDF.
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