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SJ/T 11514-2015Thermosetting Conductive Paste for Printed Circuit Board (PCB) (English PDF)

印制电路用热固型导体浆料

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Issued by

Ministry of Industry and Information Technology

Level / Type

National · Recommended

Issue date

April 30, 2015

Implementation date

October 1, 2015

Scope

SJ/T 11514-2015 is the English-translated version of 印制电路用热固型导体浆料.

SJ/T 11514-2015 — This Standard specifies the terms and definitions for printed circuits thermosetting conductive paste, requirements, test methods, inspection rules and packaging, labeling, transportation and so on.

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Document preview — SJ/T 11514-2015

National Standard of the People's Republic of China

ICS: 31.03
Classification: L 90

Issued by: Ministry of Industry and Information Technology

What this standard covers1
Document data2
Standards quoted by this document3

What this standard covers

This Standard specifies the terms and definitions for printed circuits thermosetting conductive paste, requirements, test methods, inspection rules and packaging, labeling, transportation and so on. This Standard applies to the printed circuit board conductive pattern, contacts, contacts, jumpers, hole fill, and membrane switch, buried resistors, RFID and other manufacturing conductive paste by heat curing, including silver conductor, copper conductor paste, silver and carbon conductive carbon paste mixed slurry.

Document data

International classification (ICS): 31.03.

Chinese classification (CCS): L90.

Estimated length of the Chinese original: 16,199 words.

Standards quoted by this document

GB/T 191-2008; GB/T 2036; GB/T 2421.1-2008; GB/T 2423.3-2006; GB/T 2423.16-2008; GB/T 2423.22-2002; GB/T 4677-2002; GB/T 2828.1-2003; GB/T 4588.2-1996; GB/T 5547-2007; GB/T 6739-2006; GB/T 6753.1-2007; GB/T 9286-1998; GB/T 17473.3-2008; GB/T 13557-1992; SJ/T 11171-1998

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 11 pages — is available in the English PDF.

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