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SJ/T 11507-2015Oxide coating etching buffer for integrated circuit (English PDF)

集成电路用氧化层缓冲腐蚀液

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Issued by

Ministry of Industry and Information Technology

Level / Type

National · Recommended

Issue date

April 30, 2015

Implementation date

October 1, 2015

Scope

SJ/T 11507-2015 is the English-translated version of 集成电路用氧化层缓冲腐蚀液.

SJ/T 11507-2015 — This Standard specifies the integrated circuit with a buffer layer of oxide etching solution terminology, character, technical requirements, test methods, inspection rules, packaging, labeling, storage, and transportation.

This Standard applies to an integrated circuit with a buffer layer of oxide etching solution. This Standard does not involve the use of security issues.

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Document preview — SJ/T 11507-2015

National Standard of the People's Republic of China

ICS: 31.03
Classification: L 90

Issued by: Ministry of Industry and Information Technology

What this standard covers1
Document data2
Standards quoted by this document3

What this standard covers

This Standard specifies the integrated circuit with a buffer layer of oxide etching solution terminology, character, technical requirements, test methods, inspection rules, packaging, labeling, storage, and transportation. This Standard applies to an integrated circuit with a buffer layer of oxide etching solution. This Standard does not involve the use of security issues. Use of this standard shall be responsible for establishing appropriate security restrictions terms and scope of health.

Document data

International classification (ICS): 31.03.

Chinese classification (CCS): L90.

Estimated length of the Chinese original: 16,176 words.

Standards quoted by this document

GB/T 191; GB/T 601; GB/T 602; GB/T 603; GB/T 605; GB/T 6678; GB/T 6682; GB/T 9727; GB/T 9728; GB/T 9729; GB/T 9742; GB/T 11446.1; GB 15258; GB 50472; SJ/T 11510-2015

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 11 pages — is available in the English PDF.

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