SJ/T 11390-2009Test method for lead-free solders (English PDF)
无铅焊料试验方法
SJ/T 11390 | Evolution and historical versions
| Std ID | Title | Status |
|---|---|---|
| SJ/T 11390-2019 | Fluxes for lead-free soldering application | Valid |
| SJ/T 11390-2009 | Test method for lead-free solders | Obsolete |
SJ/T 11390-2009 is obsolete. It has been replaced by SJ/T 11390-2019. This page sells the obsolete edition, for projects and contracts that still cite it.
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
November 17, 2009
Implementation date
January 1, 2010
Scope
SJ/T 11390-2009 is the English-translated version of 无铅焊料试验方法.
SJ/T 11390-2009 is the Chinese industry standard "Test method for lead-free solders". It was issued on November 17, 2009 by the Ministry of Industry and Information Technology, and took effect on January 1, 2010. It is obsolete: it has been replaced by SJ/T 11390-2019.
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Document preview — SJ/T 11390-2009
National Standard of the People's Republic of China
Issued by: Ministry of Industry and Information Technology
Contents
- Document data
1 Document data
Sector: Electronics (industry standard).
Issuing body: Ministry of Industry and Information Technology.
Date of issue: 2009-11-17.
Date of implementation: 2010-01-01.
Status: obsolete, replaced by SJ/T 11390-2019.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — all pages — is available in the English PDF.
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