SJ/T 11186-2019General specification for solder paste (English PDF)
焊锡膏通用规范
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
January 1, 2019
Implementation date
July 1, 2020
Scope
SJ/T 11186-2019 is the English-translated version of 焊锡膏通用规范.
SJ/T 11186-2019 is the Chinese standard "General specification for solder paste". This standard specifies the terms and definitions, requirements, test methods, inspection rules, marking, packaging, transportation and storage of solder paste.
This standard applies to solder paste for soldering electronic products. It was issued by Ministry of Industry and Information Technology.
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Document preview — SJ/T 11186-2019
National Standard of the People's Republic of China
- ICS
- 31.030
- Classification
- L90
Issued by: Ministry of Industry and Information Technology
1 Foreword
SJ/T 11186-2019 was issued by Ministry of Industry and Information Technology on 24 December 2019 and has been in force since 1 July 2020.
2 Scope
This standard specifies the terms and definitions, requirements, test methods, inspection rules, marking, packaging, transportation and storage of solder paste. This standard applies to solder paste for soldering electronic products.
3 About this standard
Sector: Electronics Industry Standard (Recommended)
Issued by: Ministry of Industry and Information Technology
English translation: about 13 pages (approximate)
Chinese original: about 20,220 characters
4 Classification and status
International classification (ICS): 31.030
Chinese Standard Classification (CCS): L 90
Prefix SJ/T: recommended standard.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 13 pages — is available in the English PDF.
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