SJ/T 10454-2020Dielectric paste for multilayer lay out of thick film hybrid integrated circuits (English PDF)
厚膜混合集成电路多层布线用介质浆料
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
December 9, 2020
Implementation date
April 1, 2021
Scope
SJ/T 10454-2020 is the English-translated version of 厚膜混合集成电路多层布线用介质浆料.
SJ/T 10454-2020 — This standard specifies the technical requirements, test methods, inspection rules, packaging, storage and transportation of dielectric pastes for thick film hybrid integrated circuit multilayer wiring (hereinafter referred to as pastes).
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Document preview — SJ/T 10454-2020
National Standard of the People's Republic of China
- ICS
- 31.030
- Classification
- L 90
- Replacing
- SJ/T 10454-1993
Issued by: Ministry of Industry and Information Technology
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard specifies the technical requirements, test methods, inspection rules, packaging, storage and transportation of dielectric pastes for thick film hybrid integrated circuit multilayer wiring (hereinafter referred to as pastes). This standard applies to dielectric pastes for thick film hybrid integrated circuit multilayer wiring that match gold, palladium and silver conductor pastes.
Document data
International classification (ICS): 31.030.
Chinese classification (CCS): L90.
Estimated length of the Chinese original: 11,132 words.
Supersedes the earlier edition SJ/T 10454-1993.
Standards quoted by this document
GB/T 2423 2-2008; GB/T 2423.3 2006; GB/T 2423.22-2012; SJ/T 11512-2015
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.
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